A3P250-2PQG208I

The A3P250-2PQG208I is a ProASIC3 Flash-based Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides a mid-range combination of logic capacity, on-chip memory, and I/O density for industrial applications.

With 6,144 logic elements, 151 user I/Os and 36,864 bits of embedded RAM, this surface-mount device targets embedded and industrial designs that require configurable logic, modest embedded memory, and a broad operating temperature range.

Key Features

• Core Logic  Approximately 6,144 logic elements providing a total of 250,000 gates for implementing custom digital functions and glue logic.
• Embedded Memory  Total on-chip RAM of 36,864 bits for data buffering, small FIFOs, and state storage.
• I/O Density  151 general-purpose I/Os to support wide peripheral and bus interfacing requirements.
• Power  Operates from a core supply range of 1.425 V to 1.575 V to meet low-voltage system requirements.
• Package & Mounting  208-BFQFP package (supplier device package: 208-PQFP, 28×28) in a surface-mount form factor for compact PCB designs.
• Temperature Range  Industrial operating temperature from −40 °C to 100 °C for robust performance in demanding environments.
• Environmental Compliance  RoHS compliant to support environmentally conscious manufacturing processes.

Typical Applications

• Industrial Control & Automation  Implement control logic, interface sensors and actuators, and manage configurable I/O in industrial equipment within the specified temperature range.
• Embedded System Glue Logic  Consolidate discrete logic and custom timing functions using available logic elements and gates to reduce BOM and PCB complexity.
• Interface Conversion & Bridging  Leverage 151 I/Os to handle parallel or mixed-signal interface routing and protocol adaptation between subsystems.
• Prototyping and Evaluation  Use the device’s logic capacity and embedded RAM for validating digital designs and early system integration in an industrial-grade package.

Unique Advantages

• Balanced Logic Capacity: The combination of 6,144 logic elements and 250,000 gates supports complex control and glue-logic tasks without overprovisioning.
• On-Chip RAM for Local Storage: 36,864 bits of embedded RAM enable small buffering and state retention without external memory.
• High I/O Count: 151 user I/Os provide flexibility for multi-channel interfacing and peripheral integration.
• Industrial Temperature Rating: Rated for −40 °C to 100 °C operation to meet environmental demands of industrial deployments.
• Compact Surface-Mount Package: 208-BFQFP (28×28 PQFP footprint) supports dense board layouts and automated assembly.
• Regulatory Friendly: RoHS compliance simplifies environmental and supply-chain considerations.

Why Choose A3P250-2PQG208I?

The A3P250-2PQG208I delivers a practical mix of logic, memory and I/O suitable for industrial embedded designs that require configurable digital functions in a compact, surface-mount package. Its specified core voltage range and industrial temperature rating make it a fit for applications that demand reliable operation across varied conditions.

This device is well-suited for engineers and procurement teams seeking a Microchip ProASIC3 FPGA option with moderate logic capacity, significant I/O resources, and on-chip RAM for localized buffering—providing a deterministic, reconfigurable building block for control, interfacing, and prototype applications.

Request a quote or submit an inquiry to obtain pricing and availability for the A3P250-2PQG208I.