A3P250-2PQ208

The A3P250-2PQ208 is a ProASIC3 field programmable gate array (FPGA) from Microchip Technology targeted at commercial embedded designs. It provides on-chip programmable logic and memory resources suitable for integrating control, interface, and custom logic functions in surface-mount assemblies.

With 6,144 logic elements (approximately 250,000 gates), 151 user I/Os, and embedded memory, this device delivers a balance of logic density and I/O capability in a 208-pin BFQFP package for commercial applications operating between 0 °C and 85 °C.

Key Features

• Logic Capacity  6,144 logic elements (reported as 6,144 CLBs/LABs) providing approximately 250,000 gates for implementing combinational and sequential logic.
• Embedded Memory  Approximately 0.037 Mbits (36,864 bits) of on-chip RAM for small buffers, state storage, and local data paths.
• I/O Resources  151 user I/Os to support multiple parallel interfaces, custom bus implementations, and board-level connectivity.
• Power and Core Voltage  Core voltage range of 1.425 V to 1.575 V to match supported supply domains and system power design.
• Package and Mounting  208-BFQFP (supplier package 208-PQFP, 28×28) in a surface-mount form factor for PCB assembly.
• Operating Conditions  Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant for conformance with common materials restrictions.

Typical Applications

• Commercial embedded systems  Implement custom control logic, protocol handling, or glue logic in commercial products and OEM designs.
• Interface bridging  Consolidate multiple parallel or serial interfaces and implement custom data-path logic using available I/Os and on-chip memory.
• Prototyping and development  Evaluate and validate FPGA-based functions for commercial product development and proof-of-concept implementations.
• Custom control and logic integration  Integrate application-specific finite-state machines, timing control, and peripheral coordination within a single device footprint.

Unique Advantages

• Moderate logic density: 6,144 logic elements and approximately 250,000 gates enable substantial programmable logic without large-package complexity.
• Generous I/O count: 151 user I/Os provide flexibility to connect multiple peripherals and external devices directly to the FPGA.
• Compact surface-mount package: 208-BFQFP (28×28) supports PCB space-constrained commercial designs while remaining compatible with standard assembly processes.
• Defined core voltage window: 1.425 V to 1.575 V core supply range simplifies power-supply specification and integration into existing boards.
• Commercial temperature rating: Operates across a 0 °C to 85 °C range suitable for a wide range of commercial environments.
• RoHS compliant: Meets materials compliance expectations for commercial electronics manufacturing.

Why Choose A3P250-2PQ208?

The A3P250-2PQ208 positions itself as a practical ProASIC3 FPGA option for commercial designers who need a balance of logic capacity, embedded memory, and high I/O density in a surface-mount 208-pin BFQFP package. Its specified core voltage range and commercial temperature rating make it suitable for OEMs and embedded system developers focused on reliable, programmable logic integration.

As a Microchip Technology product, this FPGA is appropriate for teams looking to consolidate interface and control functions into a single device footprint while meeting RoHS requirements and conventional commercial operating conditions.

Request a quote or submit an inquiry to get pricing and availability for the A3P250-2PQ208 and to discuss how it fits your next commercial design.