A3P250-2FGG144I

The A3P250-2FGG144I is a ProASIC3 field programmable gate array (FPGA) IC designed for industrial applications requiring programmable logic, substantial I/O and on-chip memory. It integrates 6,144 logic elements and 36,864 bits of embedded RAM to support custom digital designs within a compact 144-LBGA package.

Key Features

• Programmable Logic  Provides 6,144 logic elements (equivalent to the device’s logic resource count) and approximately 250,000 gates for implementing custom combinational and sequential logic.
• Embedded Memory  Includes 36,864 bits of on-chip RAM (approximately 0.037 Mbits) to support buffering, FIFOs and small data tables without external memory.
• I/O Capacity  Offers 97 general-purpose I/O pins to interface with peripheral devices, sensors and system buses.
• Power  Operates from a core supply range of 1.425 V to 1.575 V to match system power rails and design requirements.
• Package & Mounting  Supplied in a 144-LBGA package; supplier device package listed as 144-FPBGA (13×13). Designed for surface-mount assembly.
• Industrial Grade Temperature  Specified for an operating temperature range of −40°C to 100°C for use in temperature-demanding environments.
• RoHS Compliance  RoHS-compliant construction supports regulatory and environmental requirements.

Unique Advantages

• Substantial logic capacity: 6,144 logic elements and approximately 250,000 gates enable implementation of mid-range digital functions within a single device, reducing board-level complexity.
• On-chip RAM for local data handling: 36,864 bits of embedded RAM provide internal buffering and small data storage to minimize dependence on external memory components.
• Robust I/O count: 97 I/O pins allow flexible interfacing to peripherals and external logic without additional I/O expanders.
• Industrial temperature rating: −40°C to 100°C operation supports designs that require extended temperature capability.
• Compact surface-mount package: 144-LBGA (144-FPBGA, 13×13) delivers a dense footprint for space-constrained PCBs while supporting automated assembly.
• Defined core supply window: Narrow voltage supply range (1.425 V–1.575 V) enables predictable power budgeting and stable core operation.

Why Choose A3P250-2FGG144I?

The A3P250-2FGG144I balances mid-range programmable logic resources, embedded RAM and a healthy I/O count in a compact, surface-mount 144-LBGA package suitable for industrial-temperature deployments. Its specified logic element count, memory capacity and defined power and thermal limits make it a practical choice for engineers targeting reliable, integrated FPGA solutions without the need for external logic or memory for many functions.

This device is well suited to designs that require a predictable supply range, on-chip memory for local data handling, and an industrial operating temperature range—providing a stable platform for embedded digital logic tasks across a range of industrial applications.

Request a quote or submit a purchase inquiry for the A3P250-2FGG144I to evaluate it for your next design or production run.