A3P250-2FG256

The A3P250-2FG256 is a ProASIC3 field programmable gate array (FPGA) supplied in a 256-LBGA package. It integrates programmable logic, on-chip memory and a high I/O count to support custom digital functions and interface logic for commercial embedded systems.

With 6,144 logic elements, approximately 0.037 Mbits of embedded memory and 157 I/O pins, this device targets designs that require moderate logic capacity, dense external connectivity and a compact surface-mount package.

Key Features

• Core Logic  6,144 logic elements provide programmable resources for implementing custom digital functions and state machines.
• Embedded Memory  Approximately 0.037 Mbits (36,864 bits) of on-chip RAM for small buffers, FIFOs and distributed storage.
• I/O Density  157 user I/O pins to support multiple interfaces and parallel connections to external devices.
• Gate Count  250,000 gates for mapping combinational and sequential logic in mid-range designs.
• Power Supply  Operates from a supply range of 1.425 V to 1.575 V to match target system power rails.
• Package & Mounting  256-LBGA surface-mount package (supplier device package: 256-FPBGA 17×17) for compact PCB implementations.
• Temperature & Grade  Commercial grade device rated for 0°C to 85°C operating temperature range.
• RoHS Compliance  RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• Interface and Glue Logic  Use the device’s 157 I/Os and logic elements to implement protocol bridging, bus interfacing and signal conditioning between system components.
• Embedded Control  Implement control finite-state machines, timing logic and peripheral management within compact embedded products.
• Prototyping and Functional Verification  Suitable for evaluating mid-range programmable designs where moderate logic capacity and on-chip RAM are required.
• Sensor and I/O Aggregation  Aggregate multiple sensor inputs or peripheral signals using the device’s I/O count and programmable logic to simplify upstream processing.

Unique Advantages

• Balanced Logic and Memory  6,144 logic elements paired with 36,864 bits of embedded RAM provide a practical balance for control logic plus local buffering without external memory.
• High I/O Count in a Compact Footprint  157 I/Os in a 256-LBGA package enable dense board-level integration while preserving I/O flexibility.
• Compact Surface-Mount Package  The 256-FPBGA (17×17) package supports compact PCB layouts and automated assembly processes.
• Commercial Temperature Range  Rated 0°C to 85°C for a wide range of standard commercial applications.
• Regulatory Compliance  RoHS compliance supports common environmental manufacturing requirements.

Why Choose A3P250-2FG256?

The A3P250-2FG256 delivers a practical combination of programmable logic, on-chip memory and a high I/O complement in a compact 256-LBGA surface-mount package. Its specifications make it well suited for mid-range embedded designs that require custom digital logic, multiple external interfaces and modest local memory.

Designers and procurement teams seeking a commercially graded FPGA with clear supply-voltage and temperature specifications will find this device appropriate for applications where board space, I/O density and verified programmable resources matter. Its resource mix supports scalable implementations and straightforward integration into existing platforms.

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