A3P250-2FGG144

The A3P250-2FGG144 is a ProASIC3 Field Programmable Gate Array (FPGA) IC providing 6,144 logic elements, 36,864 bits of on‑chip RAM and 97 user I/O pins in a compact 144‑LBGA package. Designed for surface‑mount assembly and commercial temperature operation, this device delivers a balanced mix of logic capacity, embedded memory and I/O density for reconfigurable logic applications.

Key device attributes include a 1.425 V to 1.575 V core supply range, commercial grade temperature support (0 °C to 85 °C), and RoHS compliance—making the package suitable for a wide range of general embedded and system control designs.

Key Features

• Logic Capacity  6,144 logic elements (cells) provide implementation capacity for moderate complexity logic functions and custom hardware acceleration.
• On‑Chip Memory  36,864 bits of total RAM enable local buffering, FIFO implementation and small embedded data storage directly on the FPGA fabric.
• I/O Resources  97 user I/O pins support a variety of external interfaces and signal connections without additional I/O expander components.
• Gate Count  250,000 gates for overall logic density and integration of combinational and sequential logic blocks.
• Power and Supply  Core voltage range of 1.425 V to 1.575 V allows designers to match system power rails and plan power budgeting precisely.
• Package and Mounting  144‑LBGA (supplier device package: 144‑FPBGA 13×13) in a surface‑mount form factor for compact PCB designs and automated assembly.
• Operating Range and Grade  Commercial grade device specified for 0 °C to 85 °C operation and RoHS compliant for regulatory alignment.

Typical Applications

• Embedded Control and Logic  Use the FPGA’s 6,144 logic elements and on‑chip RAM to implement custom control state machines, timing logic and glue functions in embedded systems.
• Interface Bridging and I/O Aggregation  97 I/O pins allow consolidation of multiple peripheral interfaces and protocol translation without large external chipset overhead.
• Prototyping and Hardware Acceleration  Leverage the device’s gate and logic capacity to prototype custom accelerators or offload compute kernels from a host processor.

Unique Advantages

• Well‑balanced integration: Combines 6,144 logic elements, 36,864 bits of embedded RAM and 97 I/Os to minimize external components and simplify PCB design.
• Compact, assembly‑friendly package: 144‑LBGA (144‑FPBGA 13×13) surface‑mount package supports high‑density layouts and automated manufacturing.
• Predictable power envelope: Narrow core voltage range (1.425 V–1.575 V) simplifies power supply design and system integration.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation for general‑purpose embedded and control applications.
• Regulatory alignment: RoHS compliant to meet common environmental and manufacturing requirements.

Why Choose A3P250-2FGG144?

The A3P250-2FGG144 positions itself as a compact, commercially rated FPGA option that balances logic density, embedded memory and I/O resources within a single 144‑LBGA package. Its specification set supports designers who need reconfigurable logic, local RAM and substantial I/O connectivity without increasing board footprint.

This device is appropriate for development teams and production designs focused on embedded control, interface consolidation and hardware prototyping where predictable power, package density and RoHS compliance are important selection criteria.

Request a quote or submit a pricing inquiry to evaluate the A3P250-2FGG144 for your next design or production program.