A3P250-2FG144I
| Part Description |
ProASIC3 Field Programmable Gate Array (FPGA) IC 97 36864 144-LBGA |
|---|---|
| Quantity | 278 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-FPBGA (13x13) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LBGA | Number of I/O | 97 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 6144 | Number of Logic Elements/Cells | 6144 | ||
| Number of Gates | 250000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 36864 |
Overview of A3P250-2FG144I – ProASIC3 Field Programmable Gate Array (FPGA) IC, 97 I/O, 144-LBGA
The A3P250-2FG144I is a ProASIC3 field programmable gate array (FPGA) IC from Microchip Technology designed for surface-mount applications. It integrates 250,000 gates and 6,144 logic elements with on-chip RAM and a 97-pin I/O count to support compact, industrial-grade programmable logic designs.
With a 144-LBGA package and an industrial operating temperature range of -40°C to 100°C, this device targets applications requiring dense logic integration, moderate embedded memory, and reliable operation across a wide temperature span.
Key Features
- Logic Capacity — 250,000 gates and 6,144 logic elements provide a substantial fabric for implementing custom digital logic and moderate-complexity designs.
- Embedded Memory — 36,864 bits (≈0.037 Mbits) of on-chip RAM for localized data storage and buffering within user logic.
- I/O Count — 97 general-purpose I/O pins to interface with external peripherals, sensors, and system buses.
- Package — 144-LBGA (supplier package: 144-FPBGA 13×13) for a compact surface-mount footprint suitable for space-constrained PCBs.
- Power — Core voltage supply range of 1.425 V to 1.575 V for defined low-voltage operation and system design planning.
- Temperature & Grade — Industrial grade with an operating temperature range of -40°C to 100°C for deployment in demanding thermal environments.
- Compliance — RoHS compliant, supporting regulatory requirements for lead-free and restricted-substance designs.
Unique Advantages
- High integration density: 250,000 gates and 6,144 logic elements reduce external glue logic and simplify board-level design.
- Compact packaging: 144-LBGA (13×13 FPBGA) balances pin count and PCB area for space-sensitive assemblies.
- Industrial temperature range: Specified operation from -40°C to 100°C enables use in temperature-challenging environments.
- Deterministic supply range: Narrow core voltage specification (1.425–1.575 V) aids power-supply design and margin planning.
- RoHS compliant: Supports lead-free manufacturing and environmental regulatory needs.
Why Choose A3P250-2FG144I?
The A3P250-2FG144I provides a balanced combination of logic capacity, I/O flexibility, and industrial-grade reliability in a compact LBGA package. Its on-chip memory and substantial gate/logic-element counts make it suitable for designers seeking to consolidate logic into a single FPGA while maintaining a controlled power profile and defined thermal capability.
This device is well suited to teams and projects that require a manufacturable, surface-mount FPGA solution from Microchip Technology with clear electrical and thermal specifications for predictable system integration and long-term deployment.
Request a quote or contact sales to discuss availability, lead times, and pricing for the A3P250-2FG144I.

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