A3P250-2FG144I

IC FPGA 97 I/O 144FBGA
Part Description

ProASIC3 Field Programmable Gate Array (FPGA) IC 97 36864 144-LBGA

Quantity 278 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package144-FPBGA (13x13)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case144-LBGANumber of I/O97Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs6144Number of Logic Elements/Cells6144
Number of Gates250000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits36864

Overview of A3P250-2FG144I – ProASIC3 Field Programmable Gate Array (FPGA) IC, 97 I/O, 144-LBGA

The A3P250-2FG144I is a ProASIC3 field programmable gate array (FPGA) IC from Microchip Technology designed for surface-mount applications. It integrates 250,000 gates and 6,144 logic elements with on-chip RAM and a 97-pin I/O count to support compact, industrial-grade programmable logic designs.

With a 144-LBGA package and an industrial operating temperature range of -40°C to 100°C, this device targets applications requiring dense logic integration, moderate embedded memory, and reliable operation across a wide temperature span.

Key Features

  • Logic Capacity — 250,000 gates and 6,144 logic elements provide a substantial fabric for implementing custom digital logic and moderate-complexity designs.
  • Embedded Memory — 36,864 bits (≈0.037 Mbits) of on-chip RAM for localized data storage and buffering within user logic.
  • I/O Count — 97 general-purpose I/O pins to interface with external peripherals, sensors, and system buses.
  • Package — 144-LBGA (supplier package: 144-FPBGA 13×13) for a compact surface-mount footprint suitable for space-constrained PCBs.
  • Power — Core voltage supply range of 1.425 V to 1.575 V for defined low-voltage operation and system design planning.
  • Temperature & Grade — Industrial grade with an operating temperature range of -40°C to 100°C for deployment in demanding thermal environments.
  • Compliance — RoHS compliant, supporting regulatory requirements for lead-free and restricted-substance designs.

Unique Advantages

  • High integration density: 250,000 gates and 6,144 logic elements reduce external glue logic and simplify board-level design.
  • Compact packaging: 144-LBGA (13×13 FPBGA) balances pin count and PCB area for space-sensitive assemblies.
  • Industrial temperature range: Specified operation from -40°C to 100°C enables use in temperature-challenging environments.
  • Deterministic supply range: Narrow core voltage specification (1.425–1.575 V) aids power-supply design and margin planning.
  • RoHS compliant: Supports lead-free manufacturing and environmental regulatory needs.

Why Choose A3P250-2FG144I?

The A3P250-2FG144I provides a balanced combination of logic capacity, I/O flexibility, and industrial-grade reliability in a compact LBGA package. Its on-chip memory and substantial gate/logic-element counts make it suitable for designers seeking to consolidate logic into a single FPGA while maintaining a controlled power profile and defined thermal capability.

This device is well suited to teams and projects that require a manufacturable, surface-mount FPGA solution from Microchip Technology with clear electrical and thermal specifications for predictable system integration and long-term deployment.

Request a quote or contact sales to discuss availability, lead times, and pricing for the A3P250-2FG144I.

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