A3P250-2FGG256

The A3P250-2FGG256 is a ProASIC3 Field Programmable Gate Array (FPGA) IC from Microchip Technology. It delivers a balance of programmable logic resources, embedded memory, and I/O density in a 256‑ball LBGA package.

Configured for commercial-grade applications, the device provides 6,144 logic elements, approximately 36.9 kbits of embedded RAM, 157 I/O pins, and an effective gate capacity of 250,000 gates. The part is surface-mountable and RoHS compliant, with a core supply range of 1.425 V to 1.575 V and an operating temperature range of 0 °C to 85 °C.

Key Features

• Core Logic 6,144 logic elements provide programmable resources for implementing custom digital logic.
• Embedded Memory Approximately 36.9 kbits of on-chip RAM to support data buffering and state storage.
• Logic Capacity 250,000 gates for substantial combinational and sequential logic integration.
• I/O Density 157 general-purpose I/O pins to interface with peripherals, sensors, and external devices.
• Package & Mounting 256‑LBGA package (supplier device package: 256‑FPBGA, 17×17) in a surface-mount form factor suitable for compact PCB layouts.
• Power Core supply voltage range of 1.425 V to 1.575 V for defined low-voltage operation.
• Temperature Rating Commercial operating range of 0 °C to 85 °C for temperature-controlled environments.
• Environmental Compliance RoHS compliant for reduced hazardous substances in manufacturing.

Typical Applications

• Commercial Embedded Systems — Implement custom control and logic functions where a commercial-grade FPGA with moderate logic and memory is required.
• Consumer Electronics — Integrate user interface control, peripheral bridging, and custom signal processing using the device’s logic elements and I/O count.
• Communications Equipment — Provide protocol handling, I/O aggregation, and glue-logic in communications modules with the available gates and I/O resources.
• Prototyping and Custom Logic — Rapidly evaluate and iterate digital designs using the ProASIC3 architecture and on-chip resources.

Unique Advantages

• Highly integrated logic capacity: 250,000 gates and 6,144 logic elements enable consolidation of multiple functions into a single device, reducing BOM count.
• Ample I/O for system integration: 157 I/O pins accommodate a wide range of interfaces and peripheral connections without external multiplexing.
• Compact, surface-mount packaging: 256‑LBGA (17×17 FPBGA) offers a small PCB footprint while supporting high pin density.
• Defined low-voltage operation: Core supply range of 1.425 V to 1.575 V supports designs targeting lower-voltage power domains.
• Commercial temperature suitability: Rated 0 °C to 85 °C for typical commercial deployments.
• Regulatory readiness: RoHS compliance simplifies integration into product lines requiring environmental substance controls.

Why Choose A3P250-2FGG256?

The A3P250-2FGG256 offers a pragmatic combination of logic density, on-chip memory, and I/O count in a compact 256‑LBGA package, targeted at commercial embedded and consumer applications. Its defined supply and temperature ranges, along with RoHS compliance, make it straightforward to specify into designs that require predictable electrical and environmental characteristics.

Choose this FPGA when you need a commercially graded, programmable logic device that consolidates multiple functions, reduces board-level complexity, and supports rapid prototyping or moderate-volume production with clear electrical and thermal specifications.

Request a quote or submit an inquiry to sales for pricing and availability of A3P250-2FGG256.