A3P250-2VQ100

The A3P250-2VQ100 is a ProASIC3 Field Programmable Gate Array (FPGA) in a 100-pin TQFP package, designed for commercial embedded designs requiring flexible digital logic and moderate on-chip memory. With 6,144 logic elements and approximately 36,864 bits of embedded RAM, this device targets mid-range programmable logic tasks that benefit from a compact surface-mount package and defined supply and temperature ranges.

Key Features

• Core Logic  6,144 logic elements providing roughly 250,000 gates of programmable logic capacity for implementing custom digital functions.
• Embedded Memory  Approximately 36,864 bits of on-chip RAM for buffering, small lookup tables, and local data storage.
• I/O  68 general-purpose I/O pins to support a range of peripheral connections and interface signals on compact PCBs.
• Package  100-pin TQFP package; supplier device package listed as 100-VQFP (14×14). Surface-mount mounting type simplifies PCB assembly and integration.
• Power  Specified core supply voltage range of 1.425 V to 1.575 V to match platform power requirements.
• Operating Conditions  Commercial grade device rated for operation from 0 °C to 85 °C.
• Regulatory  RoHS compliant, supporting lead-free assembly processes and environmental requirements.

Typical Applications

• Embedded Control Logic  Implement mid-range control and sequencing functions where 6,144 logic elements and on-chip RAM support custom finite-state machines and glue logic.
• Interface Bridging  Use the 68 I/O pins to adapt or translate between peripheral interfaces in compact systems.
• Prototyping and Development  Evaluate and iterate digital designs that fit within a 100-pin TQFP footprint and the specified gate, memory, and I/O resources.

Unique Advantages

• Balanced Logic Capacity:  6,144 logic elements and ~250,000 gates provide a middle-ground density for complex glue logic without excessive cost or board area.
• On-Chip Memory for Local Data:  About 36,864 bits of embedded RAM enable local buffering and small data storage, reducing external memory needs.
• Compact, Assembly-Friendly Package:  100‑pin TQFP surface-mount package and vendor 100‑VQFP (14×14) listing simplify PCB layout and manufacturing for space-constrained designs.
• Defined Power Envelope:  Narrow core supply range (1.425 V–1.575 V) supports predictable power planning and voltage regulation on system boards.
• Commercial Temperature Range:  Rated 0 °C to 85 °C for typical commercial and consumer applications where that thermal range applies.
• RoHS Compliant:  Meets lead-free and environmental requirements for modern electronics assembly.

Why Choose A3P250-2VQ100?

The A3P250-2VQ100 positions itself as a practical, commercially graded FPGA option for designers needing a moderate amount of programmable logic, local memory, and flexible I/O in a compact surface-mount package. Its combination of 6,144 logic elements, ~36,864 bits of embedded RAM, and 68 I/O pins makes it suitable for mid-range digital designs, interface bridging, and rapid prototyping where a 100-pin TQFP footprint is preferred.

For projects requiring predictable power characteristics and compliance with RoHS assembly standards, the A3P250-2VQ100 offers a clear specification set to support procurement and design decisions.

Request a quote or submit your design requirements today to get pricing and availability for the A3P250-2VQ100.