A3P250-FG144

The A3P250-FG144 is a ProASIC3 field programmable gate array (FPGA) IC from Microchip Technology intended for commercial embedded designs. It delivers moderate logic capacity with on-chip memory and a substantial I/O count in a compact 144-LBGA package.

Designed for commercial applications, the device targets designs that require up to 97 external I/Os, a defined operating temperature range, and low-voltage operation for power-sensitive systems.

Key Features

• Core Logic  Approximately 6,144 logic elements (cells) and 250,000 gates provide the device’s programmable logic capacity for custom digital functions.
• Embedded Memory  36,864 bits of on-chip RAM—approximately 0.037 Mbits—available for small buffers, FIFOs, and state storage.
• I/O Count  97 available general-purpose I/Os to support multiple peripheral interfaces and system connections.
• Package & Mounting  144-LBGA package (supplier device package: 144-FPBGA, 13×13) with surface-mount mounting type for compact PCB designs.
• Power  Nominal supply range specified at 1.425 V to 1.575 V to match low-voltage system rails.
• Operating Conditions & Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Compliance  RoHS-compliant construction for environmental regulatory alignment in commercial products.

Typical Applications

• Commercial Embedded Systems  Use for control, glue-logic, or peripheral interfacing where moderate programmable logic and up to 97 I/Os are required.
• Compact Electronics  Suitable for space-constrained designs that need a 144-LBGA package and surface-mount assembly.
• Prototyping and Development  Useful in development platforms needing configurable logic capacity (6,144 logic elements) and small on-chip RAM for early firmware/hardware integration.

Unique Advantages

• Balanced Logic Capacity: Provides a middle-tier programmable resource set (approximately 6,144 logic elements and 250,000 gates) for designs that don’t require high-density FPGAs but need more than simple CPLDs.
• Compact, High-I/O Package: The 144-LBGA (13×13 FPBGA) package enables many I/Os (97) in a small footprint for denser PCB layouts.
• Low-Voltage Operation: A defined supply window of 1.425 V to 1.575 V supports integration into low-voltage systems and predictable power budgeting.
• Commercial-Grade Reliability: Rated for 0 °C to 85 °C operation and RoHS compliance for mainstream electronic product deployment.
• On-Chip Memory: Embedded RAM (36,864 bits) simplifies small buffer and state-machine implementations without external memory.

Why Choose A3P250-FG144?

The A3P250-FG144 positions itself as a practical FPGA solution for commercial designs that require a balanced mix of logic, I/O capacity, and compact package size. Its combination of approximately 6,144 logic elements, 97 I/Os, and a 144-LBGA footprint makes it a fit for mid-range programmable tasks where board space and predictable low-voltage operation matter.

Manufactured by Microchip Technology, the device is suited for engineering teams and purchasers looking for a commercially graded, RoHS-compliant FPGA option with available manufacturer documentation and specifications to support design and procurement decisions.

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