A3P250-FG144T

The A3P250-FG144T is a ProASIC3 flash-based field programmable gate array (FPGA) offering 6,144 logic elements and 36,864 bits of on-chip RAM in a compact 144-LBGA (13×13) surface-mount package. Designed for applications that require configurable logic, moderate embedded memory and a substantial I/O count, this device delivers a balance of integration and rugged qualification for automotive environments.

Key Features

• Logic Capacity — 6,144 logic elements (cells) providing reprogrammable combinational and sequential logic resources suitable for mid-sized designs.
• Embedded Memory — 36,864 bits of on-chip RAM for data buffering, small lookup tables, and state storage.
• I/O and Gate Count — 97 I/O pins and approximately 250,000 gates to support multiple peripheral interfaces and custom bus logic.
• Package and Mounting — 144-LBGA (13×13) surface-mount package optimized for space-constrained PCBs while supporting reliable board-level assembly.
• Power — Core voltage supply range of 1.425 V to 1.575 V to match system power rails and design constraints.
• Automotive Qualification — AEC-Q100 qualification and Automotive grade designation for use in automotive electronic applications requiring qualified components.
• Operating Range — Specified operating temperature from -40°C to 125°C to meet broad environmental requirements.
• Compliance — RoHS-compliant device, supporting regulatory requirements for lead-free manufacturing.

Typical Applications

• Automotive Electronics — Implement control logic, sensor interfaces, and custom signal processing in automotive modules where AEC-Q100 qualification is required.
• Embedded Systems — Provide mid-range programmable logic and I/O consolidation for embedded control and interface tasks up to 6,144 logic elements.
• Custom I/O and Protocol Bridging — Use the 97 available I/O pins and on-chip memory to implement protocol conversion, glue logic, and bus interfacing.

Unique Advantages

• Automotive-qualified component: AEC-Q100 qualification and Automotive grade labeling provide confidence for designs that require qualified parts.
• Balanced integration: 6,144 logic elements and 36,864 bits of RAM combine to support complex control and interface functions while reducing external component count.
• High I/O density: 97 I/O pins enable multiple peripheral connections and flexible board-level integration.
• Wide operating temperature: Rated from -40°C to 125°C to support deployment across demanding environmental conditions.
• Compact LBGA package: 144-LBGA (13×13) offers a space-efficient footprint for compact PCB layouts without sacrificing connectivity.
• Regulatory readiness: RoHS compliance simplifies adoption in lead-free manufacturing processes.

Why Choose A3P250-FG144T?

The A3P250-FG144T positions itself as a mid-capacity, flash-based FPGA that combines a substantial logic element count, on-chip RAM, and a generous I/O complement in a compact LBGA package. Its AEC-Q100 qualification and -40°C to 125°C operating range make it suitable for designs that demand both reprogrammable logic and automotive-grade reliability.

This device is well suited for engineers and procurement teams building systems that require configurable digital logic, protocol interfacing, and reliable operation in temperature- and qualification-sensitive environments. The A3P250-FG144T offers a pragmatic balance of integration, I/O capability, and component qualification for long-term, robust designs.

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