A3P250-FG256I

The A3P250-FG256I is a ProASIC3 Field Programmable Gate Array (FPGA) from Microchip Technology designed for industrial applications. It delivers a mid-range logic capacity with a balance of I/O, on-chip memory, and a compact ball-grid package suited for surface-mount assembly.

With 6,144 logic elements, 157 I/O pins, approximately 36,864 bits of embedded memory, and industrial operating range, this device is targeted at designs that require reconfigurable digital logic, reliable operation over a wide temperature span, and a low-voltage core rail.

Key Features

• Core Logic  6,144 logic elements (equivalent to 250,000 gates) provide mid-range programmable logic capacity for implementing custom digital functions and control algorithms.
• Embedded Memory  Approximately 36,864 bits of on-chip RAM to support buffering, small lookup tables, and state storage within the FPGA fabric.
• I/O Density  157 I/O pins enable multiple external interfaces and parallel connectivity for sensors, actuators, and peripheral devices.
• Package & Mounting  256-LBGA (256-FPBGA, 17×17) surface-mount package offering compact board footprint and soldered BGA reliability.
• Power  Core voltage supply range of 1.425 V to 1.575 V to match low-voltage system rails.
• Temperature & Grade  Industrial-grade device rated for operation from −40 °C to 100 °C, suitable for harsh-environment deployments.
• Environmental Compliance  RoHS compliant to support regulatory and manufacturing requirements.

Typical Applications

• Industrial Control and Automation  Use the FPGA's 6,144 logic elements and 157 I/O to implement custom control logic, signal aggregation, and real-time interfacing in industrial systems operating across a wide temperature range.
• Embedded Logic Consolidation  Replace multiple discrete logic components by integrating glue logic, state machines, and timing control into a single programmable device.
• Prototyping and Custom Digital Design  Rapidly iterate and validate custom digital functions using field-programmable resources and on-chip memory for temporary storage and lookup functions.

Unique Advantages

• Mid‑range capacity: 6,144 logic elements and 250,000 gates enable meaningful system consolidation without excess resource overhead.
• Balanced I/O and memory: 157 I/O pins combined with approximately 36,864 bits of embedded RAM support both I/O-intensive and modest data‑buffering requirements.
• Industrial temperature rating: Operation from −40 °C to 100 °C supports deployment in demanding environmental conditions.
• Compact BGA package: 256-LBGA (17×17) footprint optimizes board area while providing a robust surface-mount solution.
• Low-voltage core: Core supply range of 1.425 V to 1.575 V aligns with modern low-voltage system architectures.
• RoHS compliant: Meets common environmental requirements for commercial and industrial manufacturing processes.

Why Choose A3P250-FG256I?

The A3P250-FG256I is positioned for engineers seeking a mid-range FPGA that combines a practical mix of logic elements, I/O capacity, and embedded memory in a compact 256-LBGA package. Its industrial temperature rating and RoHS compliance make it suitable for products that require reliable operation across temperature extremes and adherence to environmental regulations.

This device is a fit for designs that need flexible, reconfigurable digital logic with a defined resource set—providing a straightforward path to consolidate discrete logic, implement custom controllers, and support prototype-to-production transitions.

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