A3P250-FGG144

The A3P250-FGG144 is a ProASIC3 Field Programmable Gate Array (FPGA) delivered in a 144-LBGA package for surface-mount applications. It provides 6,144 logic elements, approximately 36.9 Kbits of on-chip RAM, and 97 general-purpose I/Os in a commercial-grade, RoHS-compliant device.

With a narrow core supply range (1.425–1.575 V) and an operating temperature of 0 °C to 85 °C, this FPGA targets commercial embedded designs that require moderate logic density, on-chip memory, and a compact 13 × 13 mm BGA footprint.

Key Features

• Logic Capacity  6,144 logic elements provide the programmable resources for glue logic, protocol handling, and moderate-density custom digital functions.
• Embedded Memory  Approximately 36.9 Kbits of on-chip RAM supports small buffers, FIFOs, and state storage without external memory.
• I/O Count  97 user I/Os give flexible interface options for parallel buses, GPIO expansion, and mixed-signal front-end connectivity (external logic required as applicable).
• Gate Density  250,000 gates of logic capacity to map combinational and sequential designs within a compact silicon footprint.
• Power  Core supply specified at 1.425 V to 1.575 V for low-voltage system integration and predictable power budgeting.
• Package and Mounting  144-LBGA (supplier package: 144-FPBGA 13×13) in a surface-mount form factor for compact board layout and reliable soldered connections.
• Temperature and Grade  Commercial-grade device rated for 0 °C to 85 °C operation, suitable for standard commercial environments.
• Compliance  RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• Commercial Embedded Systems  Implement control logic and glue functions where moderate logic density and embedded RAM are required within commercial temperature ranges.
• Peripheral and Interface Control  Use the 97 I/Os for multiplexed interfaces, bus bridging, or custom I/O expansion in compact, surface-mount designs.
• Prototyping and Integration  Deploy as a reprogrammable platform for validating digital subsystems that need up to 6,144 logic elements and on-chip memory.

Unique Advantages

• Balanced Logic and Memory Capacity: 6,144 logic elements paired with approximately 36.9 Kbits of embedded RAM gives designers a compact, self-contained FPGA resource for many mid-density functions without external SRAM.
• Generous I/O Count: Ninety-seven I/Os enable flexible connectivity options for multi-peripheral designs and board-level integration.
• Compact BGA Package: 144-LBGA (13 × 13 mm supplier package) supports space-constrained PCBs while providing reliable surface-mount assembly.
• Commercial-Grade Specification: Rated for 0 °C to 85 °C operation and RoHS compliant to align with standard commercial production and environmental requirements.
• Predictable Power Envelope: Defined core supply range (1.425–1.575 V) simplifies power-supply design and voltage-domain planning.

Why Choose A3P250-FGG144?

The A3P250-FGG144 is positioned for engineers seeking a commercial-grade FPGA with a balanced combination of logic elements, on-chip memory, and a high I/O count in a compact BGA package. Its specified voltage range and temperature rating make it suitable for standard commercial embedded projects that require reprogrammable logic and reliable surface-mount packaging.

This device suits designs that need moderate gate density, flexible I/O configuration, and on-chip RAM for buffering and state storage, offering a straightforward option for prototype-to-production workflows within commercial environments.

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