A3P250-FGG256

IC FPGA 157 I/O 256FBGA
Part Description

ProASIC3 Field Programmable Gate Array (FPGA) IC 157 36864 256-LBGA

Quantity 1,219 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time4 Weeks
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LBGANumber of I/O157Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs6144Number of Logic Elements/Cells6144
Number of Gates250000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits36864

Overview of A3P250-FGG256 – ProASIC3 FPGA, 157 I/O, 256-LBGA

The A3P250-FGG256 is a ProASIC3 Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides 6,144 logic elements and approximately 36,864 bits of embedded RAM in a 256-LBGA (256-FPBGA, 17×17) surface-mount package.

This commercial-grade FPGA offers a balance of gate density, on-chip memory and I/O count for programmable logic applications that require a defined supply voltage range and standard commercial operating temperature.

Key Features

  • Core Capacity  6,144 logic elements and approximately 250,000 gates provide the device’s programmable logic resources for implementing custom logic functions.
  • Embedded Memory  36,864 bits of on-chip RAM for buffering, small FIFOs or lookup tables.
  • I/O Count  157 general-purpose I/O pins to support diverse interfacing requirements.
  • Package & Mounting  256-LBGA (supplier device package: 256-FPBGA, 17×17) in a surface-mount form factor for compact PCB designs.
  • Power  Specified supply voltage range of 1.425 V to 1.575 V for core operation.
  • Operating Temperature & Grade  Commercial-grade device rated for 0 °C to 85 °C ambient operation.
  • Compliance  RoHS-compliant manufacturing status.

Unique Advantages

  • Balanced logic density: 6,144 logic elements combined with 250,000 gates support mid-range programmable designs without overspecifying capacity.
  • On-chip memory for control tasks: 36,864 bits of embedded RAM enable local buffering and small data storage without external RAM.
  • Generous I/O connectivity: 157 I/O pins allow flexible interfacing to peripherals, sensors and other system components.
  • Compact BGA footprint: 256-LBGA (17×17) package provides a high-pin-count solution in a compact surface-mount package suitable for space-constrained PCBs.
  • Defined electrical and thermal envelope: Explicit supply voltage range (1.425–1.575 V) and commercial temperature rating (0 °C–85 °C) simplify system-level power and thermal planning.
  • RoHS compliance: Meets common regulatory requirements for lead-free assembly and environmental considerations.

Why Choose A3P250-FGG256?

The A3P250-FGG256 positions itself as a commercial-grade programmable logic device that combines mid-range logic capacity, a practical amount of embedded RAM and a high I/O count in a compact 256-LBGA package. Its defined supply voltage and temperature specifications make it suitable for designs that require predictable electrical and thermal behavior.

This part is appropriate for teams and projects that need a balance of integration and board-level density while maintaining standard commercial operating parameters and RoHS compliance. It is a straightforward choice when 6,144 logic elements, ~36,864 bits of on-chip RAM and 157 I/Os meet system requirements.

Request a quote or submit a parts inquiry to obtain pricing, availability and ordering information for the A3P250-FGG256.

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