A3P250-PQG208

The A3P250-PQG208 is a ProASIC3 Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides a combination of programmable logic capacity, on-chip memory, and a substantial I/O count in a 208‑lead BFQFP package for commercial embedded designs.

With 250,000 gates, 6,144 logic elements and support for a 1.425 V to 1.575 V supply, the device targets commercial applications that require moderate logic density, extensive I/O, and compact surface‑mount packaging within a 0 °C to 85 °C operating range.

Key Features

• Core & Logic 250,000 gates and 6,144 logic elements provide programmable combinational and sequential resources for custom logic implementation.
• Embedded Memory Approximately 0.037 Mbits of on‑chip RAM for small buffers, state storage and local data processing.
• I/O Capacity 151 available I/O pins to support multiple interfaces, peripheral connections and external signal control.
• Power Operates from a defined supply range of 1.425 V to 1.575 V to match designs that require controlled low‑voltage operation.
• Package & Mounting 208‑BFQFP surface‑mount package (supplier device package: 208‑PQFP, 28×28) for compact PCB integration and solderable surface‑mount assembly.
• Operating Range & Grade Commercial grade device rated for operation from 0 °C to 85 °C.
• Environmental Compliance RoHS compliant.

Typical Applications

• Commercial embedded systems — Implement control logic and custom processing within temperature and voltage ranges common to commercial electronics.
• I/O consolidation and interface bridging — Use the 151 I/O pins to aggregate signals, implement protocol converters or glue logic between subsystems.
• Custom logic and control — Deploy the 6,144 logic elements and 250,000 gates to realize state machines, control algorithms and application‑specific functions.

Unique Advantages

• High logic capacity: 250,000 gates and 6,144 logic elements enable substantial custom logic integration on a single device, reducing board-level component count.
• Generous I/O count: 151 I/O pins provide flexibility for connecting multiple peripherals, sensors and interfaces without external multiplexing.
• Compact, manufacturable package: 208‑lead BFQFP surface‑mount package supports dense PCB layouts and standard assembly processes.
• Controlled low‑voltage operation: Narrow supply window (1.425 V–1.575 V) supports designs that require consistent low‑voltage rails.
• Commercial temperature suitability: Rated 0 °C to 85 °C for deployment in a wide range of commercial environments.
• RoHS compliant: Meets common environmental compliance expectations for commercial products.

Why Choose A3P250-PQG208?

The A3P250-PQG208 delivers a balanced blend of logic capacity, on‑chip memory and I/O density in a compact 208‑lead package from Microchip Technology. Its specified voltage range and commercial temperature rating make it suitable for designers who need reliable programmable logic and broad interfacing capability in commercial products.

This device is well suited for engineers building medium‑complexity, board‑level programmable solutions where gate count, I/O availability and surface‑mount packaging are primary selection criteria. Choosing the A3P250-PQG208 offers a clear specification set for integration into commercial embedded designs.

Request a quote or submit a sales inquiry to obtain pricing, availability and additional ordering information for the A3P250-PQG208.