A3P250-PQG208I
| Part Description |
ProASIC3 Field Programmable Gate Array (FPGA) IC 151 36864 208-BFQFP |
|---|---|
| Quantity | 1,381 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 151 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 6144 | Number of Logic Elements/Cells | 6144 | ||
| Number of Gates | 250000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 36864 |
Overview of A3P250-PQG208I – ProASIC3 FPGA IC, 6144 Logic Elements, 151 I/O
The A3P250-PQG208I is a ProASIC3 field programmable gate array (FPGA) IC from Microchip Technology designed for industrial applications. It delivers 6,144 logic elements, approximately 36.9 kbits of embedded memory, and up to 151 general-purpose I/Os in a 208-pin BFQFP package.
This device targets designs that require moderate logic capacity, flexible I/O counts and industrial thermal range, with a supply voltage window of 1.425 V to 1.575 V and RoHS compliance for regulatory conformity.
Key Features
- Core Logic 6,144 logic elements and approximately 250,000 gates provide implementation capacity for combinational and sequential logic functions.
- Embedded Memory Approximately 36.9 kbits of on-chip RAM to support buffering, state storage and small lookup tables without external memory.
- I/O Count 151 available I/Os to support a range of peripheral interfaces and signal routing within system designs.
- Power Specified supply voltage range of 1.425 V to 1.575 V for core power requirements.
- Package & Mounting 208-BFQFP package (supplier device package: 208-PQFP, 28×28) with surface-mount mounting type for PCB assembly.
- Temperature & Grade Industrial grade device rated for operation from −40 °C to 100 °C, suitable for harsher environments than commercial-temperature parts.
- Compliance RoHS compliant, meeting common environmental material requirements.
Typical Applications
- Industrial Control Logic capacity and industrial temperature rating make the device suitable for control logic, I/O aggregation and timing functions in factory automation equipment.
- Embedded System Interfaces High I/O count supports bridging, protocol handling and custom peripheral interfacing in embedded platforms.
- OEM and Custom Electronics Moderate on-chip memory and logic resources are appropriate for custom logic integration, reducing external component count in OEM products.
- Prototyping and Low- to Mid-Complexity Designs A balance of logic elements, RAM and I/O allows rapid iteration of designs that require deterministic, reprogrammable hardware logic.
Unique Advantages
- Balanced Logic and Memory: 6,144 logic elements combined with embedded RAM provide sufficient on-chip resources for many mid-range FPGA designs without immediate need for external memory.
- Generous I/O Availability: 151 I/Os enable flexible connectivity to sensors, actuators and peripherals, simplifying board-level routing and integration.
- Industrial Operating Range: Rated from −40 °C to 100 °C to support deployment in industrial environments where extended temperature tolerance is required.
- Compact Surface-Mount Package: 208-pin BFQFP in a 28×28 supplier package footprint supports compact PCB layouts and standard surface-mount assembly processes.
- Regulatory Compliance: RoHS compliance reduces material-restriction concerns for regulated markets and product lines.
- Vendor Backing: Manufactured by Microchip Technology, providing consistency in supply for production and development needs.
Why Choose A3P250-PQG208I?
The A3P250-PQG208I positions itself as a practical choice for engineers seeking a mid-range FPGA with a strong combination of logic density, I/O flexibility and industrial temperature capability. Its 6,144 logic elements, roughly 36.9 kbits of embedded memory and 151 I/Os make it well suited for control logic, interface bridging and custom logic integration where board space and component count matter.
Backed by Microchip Technology and supplied in a surface-mount 208-BFQFP package, this device offers a straightforward integration path for OEMs and system designers focused on reliable, industrial-grade designs that conform to RoHS requirements.
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