A3P250-PQG208I

IC FPGA 151 I/O 208QFP
Part Description

ProASIC3 Field Programmable Gate Array (FPGA) IC 151 36864 208-BFQFP

Quantity 1,381 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case208-BFQFPNumber of I/O151Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs6144Number of Logic Elements/Cells6144
Number of Gates250000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits36864

Overview of A3P250-PQG208I – ProASIC3 FPGA IC, 6144 Logic Elements, 151 I/O

The A3P250-PQG208I is a ProASIC3 field programmable gate array (FPGA) IC from Microchip Technology designed for industrial applications. It delivers 6,144 logic elements, approximately 36.9 kbits of embedded memory, and up to 151 general-purpose I/Os in a 208-pin BFQFP package.

This device targets designs that require moderate logic capacity, flexible I/O counts and industrial thermal range, with a supply voltage window of 1.425 V to 1.575 V and RoHS compliance for regulatory conformity.

Key Features

  • Core Logic  6,144 logic elements and approximately 250,000 gates provide implementation capacity for combinational and sequential logic functions.
  • Embedded Memory  Approximately 36.9 kbits of on-chip RAM to support buffering, state storage and small lookup tables without external memory.
  • I/O Count  151 available I/Os to support a range of peripheral interfaces and signal routing within system designs.
  • Power  Specified supply voltage range of 1.425 V to 1.575 V for core power requirements.
  • Package & Mounting  208-BFQFP package (supplier device package: 208-PQFP, 28×28) with surface-mount mounting type for PCB assembly.
  • Temperature & Grade  Industrial grade device rated for operation from −40 °C to 100 °C, suitable for harsher environments than commercial-temperature parts.
  • Compliance  RoHS compliant, meeting common environmental material requirements.

Typical Applications

  • Industrial Control  Logic capacity and industrial temperature rating make the device suitable for control logic, I/O aggregation and timing functions in factory automation equipment.
  • Embedded System Interfaces  High I/O count supports bridging, protocol handling and custom peripheral interfacing in embedded platforms.
  • OEM and Custom Electronics  Moderate on-chip memory and logic resources are appropriate for custom logic integration, reducing external component count in OEM products.
  • Prototyping and Low- to Mid-Complexity Designs  A balance of logic elements, RAM and I/O allows rapid iteration of designs that require deterministic, reprogrammable hardware logic.

Unique Advantages

  • Balanced Logic and Memory:  6,144 logic elements combined with embedded RAM provide sufficient on-chip resources for many mid-range FPGA designs without immediate need for external memory.
  • Generous I/O Availability:  151 I/Os enable flexible connectivity to sensors, actuators and peripherals, simplifying board-level routing and integration.
  • Industrial Operating Range:  Rated from −40 °C to 100 °C to support deployment in industrial environments where extended temperature tolerance is required.
  • Compact Surface-Mount Package:  208-pin BFQFP in a 28×28 supplier package footprint supports compact PCB layouts and standard surface-mount assembly processes.
  • Regulatory Compliance:  RoHS compliance reduces material-restriction concerns for regulated markets and product lines.
  • Vendor Backing:  Manufactured by Microchip Technology, providing consistency in supply for production and development needs.

Why Choose A3P250-PQG208I?

The A3P250-PQG208I positions itself as a practical choice for engineers seeking a mid-range FPGA with a strong combination of logic density, I/O flexibility and industrial temperature capability. Its 6,144 logic elements, roughly 36.9 kbits of embedded memory and 151 I/Os make it well suited for control logic, interface bridging and custom logic integration where board space and component count matter.

Backed by Microchip Technology and supplied in a surface-mount 208-BFQFP package, this device offers a straightforward integration path for OEMs and system designers focused on reliable, industrial-grade designs that conform to RoHS requirements.

Request a quote or submit an inquiry to obtain pricing, availability and lead-time details for the A3P250-PQG208I. Our team can assist with volume pricing and delivery options.

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