A3P250-PQ208I
| Part Description |
ProASIC3 Field Programmable Gate Array (FPGA) IC 151 36864 208-BFQFP |
|---|---|
| Quantity | 117 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 151 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 6144 | Number of Logic Elements/Cells | 6144 | ||
| Number of Gates | 250000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 36864 |
Overview of A3P250-PQ208I – ProASIC3 Field Programmable Gate Array (FPGA) IC 151 36864 208-BFQFP
The A3P250-PQ208I is a ProASIC3 Field Programmable Gate Array from Microchip Technology delivering a mid-range, industrial‑grade programmable logic resource. It provides 6,144 logic elements, approximately 36.9 kbits of on‑chip RAM, 151 general I/O pins and a gate-equivalent capacity of 250,000 in a 208-BFQFP surface-mount package.
Designed for systems that require substantial logic integration in a compact surface-mount package and reliable operation across an extended industrial temperature range, the device addresses board-level digital design needs where on-chip memory, I/O density and industrial operating conditions matter.
Key Features
- Logic Capacity 6,144 logic elements (cells) providing logic resources for custom digital functions and glue logic implementations.
- Embedded Memory Total on‑chip RAM of 36,864 bits (approximately 0.037 Mbits) for small buffers, FIFOs and state storage within the FPGA fabric.
- I/O Density 151 I/O pins to support multiple external interfaces, peripherals and board-level connections without external GPIO expanders.
- Gate Equivalent 250,000 gate-equivalent capacity to quantify overall device complexity and integration potential.
- Power Supply Specified core voltage range of 1.425 V to 1.575 V for system power planning and supply design.
- Package and Mounting 208-BFQFP (supplier package: 208-PQFP, 28 × 28 mm) in a surface-mount form factor for conventional PCB assembly.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C, suitable for industrial environments requiring extended temperature tolerance.
- Environmental Compliance RoHS‑compliant to support lead‑free manufacturing processes.
Typical Applications
- Industrial control systems Implement custom control logic and I/O interfacing with industrial-temperature operation and 151 available I/Os.
- Board-level integration Replace multiple discrete logic devices by consolidating functions into 6,144 logic elements and 250,000 gate equivalents in a single package.
- Embedded digital peripherals Use on‑chip RAM and logic resources for small buffers, protocol adapters and peripheral controllers without external memory.
- High-density I/O designs Leverage the 151 I/O pins and the 28 × 28 mm PQFP package for compact systems requiring many external connections.
Unique Advantages
- High integration in a compact package: 6,144 logic elements and 250,000 gate equivalents reduce board-level part count and simplify system architecture.
- On-chip RAM: 36,864 bits of embedded memory enable local buffering and state retention without additional external memory components.
- Industrial operating range: Specified −40 °C to 100 °C operation supports deployments in demanding temperature environments.
- Generous I/O availability: 151 I/Os provide flexibility to connect multiple peripherals and interfaces directly to the FPGA fabric.
- Surface-mount PQFP packaging: 208‑pin BFQFP (28 × 28 mm) offers a balance of pin count and board footprint for surface-mount assembly.
- Regulatory readiness: RoHS compliance facilitates lead‑free production processes and environmental requirements.
Why Choose A3P250-PQ208I?
The A3P250-PQ208I positions itself as a mid-range, industrial-grade FPGA solution that combines 6,144 logic elements, on‑chip RAM and a high I/O count in a 208‑pin surface‑mount package. Its specified core voltage range and industrial temperature rating make it suitable for designs requiring reliable digital integration and extended environmental tolerance.
Choose this device when your design requires consolidated logic, local embedded memory, and ample I/O in a compact PQFP footprint, backed by Microchip Technology's ProASIC3 family lineage.
Request a quote or contact our sales team to check availability, lead times and to discuss how the A3P250-PQ208I can fit your next design.

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