A3P250-FGG256I

The A3P250-FGG256I is a ProASIC3 field programmable gate array (FPGA) IC from Microchip Technology. It provides a mid-range FPGA fabric with 6,144 logic elements, embedded on-chip memory, and a substantial I/O count for custom digital integration in industrial systems.

Designed for surface-mount assembly in a 256-LBGA package, this device targets applications that require reconfigurable logic, moderate embedded RAM, and industrial operating range reliability.

Key Features

• Core Logic  Approximately 6,144 logic elements for implementing custom digital functions and finite-state machines.
• On-chip Memory  Approximately 0.037 Mbits of embedded memory (36,864 bits) to support buffering, small FIFOs, and state storage.
• I/O Capacity  157 I/O pins to connect with peripherals, sensors, and external logic.
• Gate Count  Approximately 250,000 gates providing the available combinational and sequential resources for medium-complexity designs.
• Power  Specified core supply voltage range of 1.425 V to 1.575 V for regulated power-rail design.
• Package & Mounting  256-LBGA (supplier package: 256-FPBGA, 17 × 17) in a surface-mount form factor suitable for compact PCBs.
• Temperature Grade  Industrial operating range from –40 °C to 100 °C for deployment in industrial environments.
• Regulatory  RoHS compliant.

Typical Applications

• Industrial Control Systems  Use the device’s industrial temperature rating and 6,144 logic elements to implement custom control logic, signal conditioning, and I/O aggregation in factory automation equipment.
• Embedded Communication Interfaces  Leverage 157 I/Os and on-chip memory for protocol bridging, packet buffering, or custom interface logic in communication modules.
• Test and Measurement  Apply the FPGA’s reprogrammable logic and gate capacity to implement data acquisition front-ends, preprocessing, and real-time control functions.

Unique Advantages

• Balanced Logic and Memory:  6,144 logic elements combined with approximately 0.037 Mbits of embedded memory enable compact implementations of control and buffering functions without external RAM for many use cases.
• High I/O Density:  157 I/Os allow extensive peripheral and sensor interfacing directly from the FPGA fabric, reducing the need for additional interface components.
• Industrial Temperature Support:  Rated from –40 °C to 100 °C for reliable operation in harsh or temperature-variable industrial environments.
• Compact Surface-Mount Package:  256-LBGA (256-FPBGA, 17 × 17) enables space-efficient PCB layouts for high-density assemblies.
• Predictable Power Requirement:  A defined supply range of 1.425 V to 1.575 V simplifies power-rail design and regulation for the FPGA core.
• Regulatory Compliance:  RoHS compliance supports environmental and manufacturing requirements.

Why Choose A3P250-FGG256I?

The A3P250-FGG256I positions itself as a reliable mid-range ProASIC3 FPGA option for industrial designs that require a mix of reconfigurable logic, meaningful I/O capacity, and on-chip memory in a compact BGA package. Its documented logic element count, gate capacity, and operating range make it suitable for embedded control, interface, and signal-processing tasks where board space and deterministic configuration are important.

Backed by Microchip Technology manufacturing and delivered in a surface-mount 256-LBGA package, the device offers a straightforward integration path for engineers looking to balance integration, thermal tolerance, and regulatory compliance in production designs.

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