A3P250-FGG144T

IC FPGA 97 I/O 144FBGA
Part Description

ProASIC3 Field Programmable Gate Array (FPGA) IC 97 36864 144-LBGA

Quantity 1,009 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Device Package144-FPBGA (13x13)GradeAutomotiveOperating Temperature-40°C – 125°C
Package / Case144-LBGANumber of I/O97Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs6144Number of Logic Elements/Cells6144
Number of Gates250000ECCN3A991DHTS Code8542.39.0001
QualificationAEC-Q100Total RAM Bits36864

Overview of A3P250-FGG144T – ProASIC3 Field Programmable Gate Array (FPGA) IC 97 36864 144-LBGA

The A3P250-FGG144T is a ProASIC3 flash-based FPGA offering 250,000 gates and 6,144 logic elements in a 144-ball LBGA package. Designed for applications that require reconfigurable digital logic with a moderate mix of I/O and embedded memory, this device combines on-chip resources with automotive-grade qualification for deployment in demanding temperature environments.

Key attributes include 97 user I/Os, approximately 36,864 bits of embedded RAM, AEC-Q100 qualification, and an extended operating temperature range, making the device suitable for designs that require durability and long-term field operation.

Key Features

  • Core / Logic  250,000 gates and 6,144 logic elements provide a flexible fabric for implementing custom logic, control functions, and protocol handling.
  • Embedded Memory  Approximately 0.037 Mbits (36,864 bits) of on-chip RAM for buffering, small lookup tables, and state storage.
  • I/O  97 user I/Os to support multiple interfaces and signal connections in compact system designs.
  • Power  Single supply operation within a 1.425 V to 1.575 V range to match system power rails and simplify power sequencing.
  • Package & Mounting  144-LBGA (supplier package: 144-FPBGA, 13×13) in a surface-mount form factor for space-efficient board layouts.
  • Automotive Qualification & Temperature Range  AEC-Q100 qualification and an operating temperature range of −40 °C to 125 °C enable deployment in temperature-extreme and automotive applications.
  • RoHS Compliance  RoHS-compliant construction supports environmental and regulatory requirements.

Typical Applications

  • Automotive Electronics  Ideal for automotive subsystems that require reconfigurable logic with AEC-Q100 qualification and extended temperature support.
  • Embedded Control  Implement custom control logic, peripheral interfacing, and protocol translation where a moderate logic count and plentiful I/O are required.
  • Signal Conditioning & I/O Expansion  Use the device for buffering, format conversion, and expanding digital interfaces in compact, surface-mount designs.
  • Ruggedized Systems  Suitable for electronics deployed in harsh environments that require wide temperature operation and automotive-grade reliability.

Unique Advantages

  • Right-sized Logic Capacity: 6,144 logic elements (approximately 250k gates) delivers a balance of resources for mid-density FPGA implementations without unnecessary overhead.
  • Integrated On-chip RAM: Approximately 36,864 bits of embedded memory supports buffering and state storage directly in the fabric, reducing external memory needs.
  • High I/O Count in a Compact Package: 97 user I/Os in a 144-LBGA package enable multiple peripheral connections while conserving board space.
  • Automotive-Grade Reliability: AEC-Q100 qualification and −40 °C to 125 °C operation address the durability requirements of automotive and other temperature-challenging applications.
  • Narrow Supply Range for Predictable Power Integration: Operation between 1.425 V and 1.575 V supports precise power-rail design and system integration.
  • Surface-mount Package: 144-FPBGA (13×13) surface-mount format simplifies automated assembly and saves PCB area.

Why Choose A3P250-FGG144T?

The A3P250-FGG144T positions itself as a mid-density, automotive-qualified FPGA that combines ample logic elements, a substantial I/O count, and embedded RAM in a compact LBGA package. Its AEC-Q100 qualification and wide operating temperature range make it a practical choice for designers targeting rugged or automotive applications that require reconfigurable logic and dependable long-term operation.

This device is well suited for engineering teams building embedded control, interface bridging, or rugged system electronics where predictable power integration, surface-mount packaging, and automotive-grade reliability are important. The combination of logic density and I/O flexibility supports scalable designs and straightforward integration into established development flows.

Request a quote or contact sales to discuss availability, pricing, and how the A3P250-FGG144T can fit your next design.

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