A3P250-FGG144T
| Part Description |
ProASIC3 Field Programmable Gate Array (FPGA) IC 97 36864 144-LBGA |
|---|---|
| Quantity | 1,009 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-FPBGA (13x13) | Grade | Automotive | Operating Temperature | -40°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LBGA | Number of I/O | 97 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 6144 | Number of Logic Elements/Cells | 6144 | ||
| Number of Gates | 250000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | AEC-Q100 | Total RAM Bits | 36864 |
Overview of A3P250-FGG144T – ProASIC3 Field Programmable Gate Array (FPGA) IC 97 36864 144-LBGA
The A3P250-FGG144T is a ProASIC3 flash-based FPGA offering 250,000 gates and 6,144 logic elements in a 144-ball LBGA package. Designed for applications that require reconfigurable digital logic with a moderate mix of I/O and embedded memory, this device combines on-chip resources with automotive-grade qualification for deployment in demanding temperature environments.
Key attributes include 97 user I/Os, approximately 36,864 bits of embedded RAM, AEC-Q100 qualification, and an extended operating temperature range, making the device suitable for designs that require durability and long-term field operation.
Key Features
- Core / Logic 250,000 gates and 6,144 logic elements provide a flexible fabric for implementing custom logic, control functions, and protocol handling.
- Embedded Memory Approximately 0.037 Mbits (36,864 bits) of on-chip RAM for buffering, small lookup tables, and state storage.
- I/O 97 user I/Os to support multiple interfaces and signal connections in compact system designs.
- Power Single supply operation within a 1.425 V to 1.575 V range to match system power rails and simplify power sequencing.
- Package & Mounting 144-LBGA (supplier package: 144-FPBGA, 13×13) in a surface-mount form factor for space-efficient board layouts.
- Automotive Qualification & Temperature Range AEC-Q100 qualification and an operating temperature range of −40 °C to 125 °C enable deployment in temperature-extreme and automotive applications.
- RoHS Compliance RoHS-compliant construction supports environmental and regulatory requirements.
Typical Applications
- Automotive Electronics Ideal for automotive subsystems that require reconfigurable logic with AEC-Q100 qualification and extended temperature support.
- Embedded Control Implement custom control logic, peripheral interfacing, and protocol translation where a moderate logic count and plentiful I/O are required.
- Signal Conditioning & I/O Expansion Use the device for buffering, format conversion, and expanding digital interfaces in compact, surface-mount designs.
- Ruggedized Systems Suitable for electronics deployed in harsh environments that require wide temperature operation and automotive-grade reliability.
Unique Advantages
- Right-sized Logic Capacity: 6,144 logic elements (approximately 250k gates) delivers a balance of resources for mid-density FPGA implementations without unnecessary overhead.
- Integrated On-chip RAM: Approximately 36,864 bits of embedded memory supports buffering and state storage directly in the fabric, reducing external memory needs.
- High I/O Count in a Compact Package: 97 user I/Os in a 144-LBGA package enable multiple peripheral connections while conserving board space.
- Automotive-Grade Reliability: AEC-Q100 qualification and −40 °C to 125 °C operation address the durability requirements of automotive and other temperature-challenging applications.
- Narrow Supply Range for Predictable Power Integration: Operation between 1.425 V and 1.575 V supports precise power-rail design and system integration.
- Surface-mount Package: 144-FPBGA (13×13) surface-mount format simplifies automated assembly and saves PCB area.
Why Choose A3P250-FGG144T?
The A3P250-FGG144T positions itself as a mid-density, automotive-qualified FPGA that combines ample logic elements, a substantial I/O count, and embedded RAM in a compact LBGA package. Its AEC-Q100 qualification and wide operating temperature range make it a practical choice for designers targeting rugged or automotive applications that require reconfigurable logic and dependable long-term operation.
This device is well suited for engineering teams building embedded control, interface bridging, or rugged system electronics where predictable power integration, surface-mount packaging, and automotive-grade reliability are important. The combination of logic density and I/O flexibility supports scalable designs and straightforward integration into established development flows.
Request a quote or contact sales to discuss availability, pricing, and how the A3P250-FGG144T can fit your next design.

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