A3P250-FGG256T

The A3P250-FGG256T is a ProASIC3 Field Programmable Gate Array (FPGA) from Microchip Technology. It delivers a balanced mix of programmable logic, on-chip memory, and I/O capability suited for embedded and automotive designs that require AEC-Q100 qualification and extended temperature operation.

With 6144 logic elements, approximately 250,000 gates, 36,864 bits of on-chip RAM and 157 I/Os in a 256-LBGA package, this device targets applications that need moderate logic density, reliable operation across -40 °C to 125 °C, and a compact surface-mount footprint.

Key Features

• Core Logic  6144 logic elements (equivalent to 250,000 gates) provide a flexible programmable fabric for implementing control, glue-logic, and moderate-complexity signal processing.
• Embedded Memory  36,864 bits of on-chip RAM available for FIFOs, small buffers, and state storage directly within the FPGA fabric.
• I/O Density  157 user I/Os accommodate multiple interfaces, sensor connections, and peripheral control without external I/O expanders.
• Package and Mounting  256-LBGA (supplier device package: 256-FPBGA 17×17) in a surface-mount form factor for compact PCB integration.
• Power  Specified core supply range of 1.425 V to 1.575 V for predictable power provisioning and system integration.
• Automotive Qualification & Reliability  AEC-Q100 qualification and an operating temperature range of -40 °C to 125 °C support deployment in automotive environments and other temperature-challenging applications.

Typical Applications

• Automotive Control Modules  AEC-Q100 qualification and extended temperature range make the device suitable for body electronics, gateway, and control functions that require on-board programmability.
• Sensor Interface and Preprocessing  Ample I/O and embedded RAM support aggregation, buffering, and preprocessing of sensor data before passing to system controllers.
• Embedded System Glue Logic  Use the FPGA to integrate custom timing, protocol conversion, and control logic to reduce external components and simplify PCB design.

Unique Advantages

• AEC-Q100 Automotive Qualification: Provides documented qualification for automotive deployment, supporting reliability and traceability in vehicle electronics.
• Extended Temperature Range: Rated for -40 °C to 125 °C, enabling use in harsh thermal environments without derating logic resources.
• Balanced Logic and Memory: 6144 logic elements and 36,864 bits of RAM offer a practical balance for moderate-complexity designs while minimizing external components.
• High I/O Count in Compact Package: 157 I/Os in a 256-LBGA package enable dense connectivity to sensors, actuators, and external peripherals in space-constrained layouts.
• Tightly Specified Core Voltage: A narrow 1.425 V–1.575 V supply range simplifies power-supply design and ensures consistent device behavior.

Why Choose A3P250-FGG256T?

The A3P250-FGG256T positions itself as a reliable, compact FPGA option for designs that require automotive-grade qualification, moderate logic capacity, and a high I/O count. Its combination of 6144 logic elements, on-chip RAM, and 157 I/Os in a 256-LBGA surface-mount package makes it suitable for embedded control, sensor interfacing, and system integration tasks where long-term robustness and temperature resilience matter.

For designers seeking a qualified programmable device with clear electrical and environmental specifications, the A3P250-FGG256T offers a pragmatic platform that simplifies BOM and enables scalable implementations across vehicle and embedded product lines.

Request a quote or contact sales to discuss pricing, availability, and integration support for the A3P250-FGG256T.