A3P250-FG256T

The A3P250-FG256T is a ProASIC3 Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides a mid-range programmable logic resource set tailored for applications that require hardened qualification and extended temperature operation.

This device combines 6,144 logic elements, a 250,000-gate equivalent capacity, and 157 general-purpose I/Os in a compact 256-LBGA package, delivering a balance of integration, I/O density, and temperature-qualified reliability for automotive and embedded electronic designs.

Key Features

• Core Logic  6,144 logic elements and 250,000 equivalent gates provide programmable logic capacity for control, glue-logic, and custom processing tasks.
• Embedded Memory  Approximately 0.037 Mbits of on-chip RAM (36,864 bits) for fast, local data storage and buffering.
• I/O Density  157 I/Os to support wide signal interfacing and diverse peripheral connectivity in a single device.
• Package & Mounting  Available in a 256-LBGA (supplier package: 256-FPBGA, 17×17) surface-mount package for compact board integration.
• Power  Operates from a core supply voltage range of 1.425 V to 1.575 V to match system power-rail designs.
• Temperature & Qualification  Qualified to AEC‑Q100 with an operating temperature range of −40 °C to 125 °C, supporting temperature-demanding automotive environments.
• Environmental Compliance  RoHS compliant to meet lead-free and environmental requirements.

Typical Applications

• Automotive electronic systems  Programmable logic for control modules and subsystems where AEC‑Q100 qualification and extended temperature range are required.
• Embedded control  On-board logic and interfacing for microcontroller companions, signal routing, and custom finite-state machines using 6,144 logic elements.
• I/O-intensive designs  Applications that require high I/O counts—up to 157 pins—for sensor aggregation, bus bridging, or peripheral expansion.

Unique Advantages

• AEC‑Q100 Automotive Qualification:  Delivers a qualification level required for automotive electronic applications and the associated reliability expectations.
• Integrated Logic and Memory:  Combined logic resources and embedded RAM simplify design partitioning and reduce the need for external components.
• High I/O Count in a Compact Package:  157 I/Os in a 256-LBGA (17×17) package enable dense connectivity while maintaining a small PCB footprint.
• Wide Operating Temperature Range:  Rated from −40 °C to 125 °C for deployment in thermally demanding environments.
• Controlled Core Voltage:  A defined supply range of 1.425 V to 1.575 V supports stable core operation within system power constraints.
• RoHS Compliant:  Meets environmental and manufacturing requirements for lead-free assembly.

Why Choose A3P250-FG256T?

The A3P250-FG256T positions itself as a temperature‑qualified, automotive‑grade FPGA option that balances programmable capacity, I/O density, and compact packaging. With 6,144 logic elements, substantial gate-equivalent resources, and 157 I/Os, it suits designers seeking a reliable, mid-range programmable device for automotive and embedded electronic applications.

Manufactured by Microchip Technology and qualified to AEC‑Q100, this device is appropriate for engineers and OEMs focused on system robustness, extended thermal operation, and reduced component count through integrated programmable logic.

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