A3P250-FG256

The A3P250-FG256 is a ProASIC3 field programmable gate array (FPGA) offering 6,144 logic elements and 157 user I/O in a 256‑pin low‑profile BGA package. Designed for commercial‑grade applications, it provides a compact, surface‑mount FPGA option for designs that require mid‑range programmable logic density and a defined power/temperature envelope.

Key device characteristics include 36864 bits of on‑chip RAM, an operating voltage range of 1.425–1.575 V, and a commercial operating temperature range of 0 °C to 85 °C, making it suitable for a variety of commercial embedded systems and communications applications.

Key Features

• Logic Capacity 6,144 logic elements (cells) provide mid‑range programmable logic resources for glue logic, custom interfaces, and control functions.
• On‑Chip Memory Approximately 36.9 kbits (36,864 bits) of embedded RAM for FIFOs, small buffers, and state storage.
• I/O Count 157 user I/O pins to support multiple parallel interfaces and mixed signal routing across the device perimeter.
• Gate Equivalent 250,000 gates of logic equivalence to help estimate design mapping and resource needs.
• Power Supply Supported core supply range of 1.425 V to 1.575 V for predictable power budgeting.
• Package and Mounting 256‑LBGA package (supplier package: 256‑FPBGA, 17×17) delivered in a surface‑mount form factor for compact PCB integration.
• Commercial Grade Rated for operation from 0 °C to 85 °C, suitable for standard commercial environments.
• RoHS Compliant Device meets current RoHS environmental requirements.

Typical Applications

• Commercial Embedded Systems Mid‑density programmable logic for control, glue logic, and custom I/O handling in commercial products.
• Communications Equipment Interface bridging and protocol adaptation where moderate logic density and numerous I/O are required.
• Consumer Electronics Custom feature implementation and peripheral control in compact surface‑mount designs.
• Prototyping and Evaluation Platform for validating mid‑scale logic designs and verifying timing/IO allocation before production.

Unique Advantages

• Balanced Logic and I/O Count: 6,144 logic elements paired with 157 I/O pins enable flexible partitioning between compute and connectivity without oversizing the device.
• Compact BGA Package: 256‑LBGA (17×17) package supports dense PCB layouts while maintaining high I/O count in a space‑efficient footprint.
• Predictable Power Envelope: A defined supply range (1.425–1.575 V) simplifies power supply design and system integration.
• Commercial Temperature Rating: 0 °C to 85 °C rating aligns with standard commercial electronics deployment requirements.
• On‑Chip Memory for Local Storage: Approximately 36.9 kbits of embedded RAM reduces external memory dependencies for small buffering and state machines.
• RoHS Compliant: Environmentally conformant design supports regulatory and manufacturing requirements.

Why Choose A3P250-FG256?

The A3P250-FG256 fits designs that need a mid‑range FPGA with a clear balance of logic resources, on‑chip memory, and a substantial number of I/O in a compact 256‑pin BGA package. Its commercial temperature rating and defined supply voltage make it appropriate for mainstream embedded and communications applications where predictable electrical and thermal behavior matters.

Choose this device when you need a surface‑mount, RoHS‑compliant FPGA with 6,144 logic elements, 157 I/O, and approximately 36.9 kbits of embedded RAM to implement custom digital logic, interface bridging, or control functions with a compact BOM footprint.

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