A3P250-2VQ100I
| Part Description |
ProASIC3 Field Programmable Gate Array (FPGA) IC 68 36864 100-TQFP |
|---|---|
| Quantity | 1,902 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 100-VQFP (14x14) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 100-TQFP | Number of I/O | 68 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 6144 | Number of Logic Elements/Cells | 6144 | ||
| Number of Gates | 250000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 36864 |
Overview of A3P250-2VQ100I – ProASIC3 Field Programmable Gate Array (FPGA) IC 68 36864 100-TQFP
The A3P250-2VQ100I is a ProASIC3 family FPGA from Microchip Technology—an industrial-grade, surface-mount programmable logic device. It integrates 6,144 logic elements with approximately 36.9 kbits of embedded memory, 68 general-purpose I/Os and an estimated 250,000 gates in a compact 100-TQFP package.
Designed for industrial and embedded applications that require moderate logic density and on-chip memory, this device offers a defined operating window and package options that support board-level integration and reliable operation across a wide temperature range.
Key Features
- Core Logic 6,144 logic elements (cells) providing the programmable fabric for custom digital logic implementation and system glue logic.
- Embedded Memory 36,864 bits of on-chip RAM (approximately 36.9 kbits) for buffering, state storage and small LUT-based tables.
- I/O Count 68 user I/Os to support multiple peripheral interfaces and board-level connectivity without immediate need for external expanders.
- Logic Capacity Approximately 250,000 gates of equivalent logic capacity for mid-density FPGA implementations.
- Power Core supply voltage specified between 1.425 V and 1.575 V for predictable power design and supply planning.
- Package & Mounting 100-TQFP package (supplier device package noted as 100-VQFP, 14×14) in a surface-mount mount style for compact PCB layouts.
- Industrial Temperature Range Rated for operation from −40°C to 100°C to meet industrial-environment thermal requirements.
- RoHS Compliance RoHS compliant material status for environmental and regulatory considerations.
Typical Applications
- Industrial Control On-board programmable logic for control functions, state machines and interface handling in industrial equipment within the specified temperature range.
- Embedded Systems Integration of mid-density custom logic and on-chip RAM for embedded processing glue logic, protocol handling and peripheral aggregation.
- Interface Bridging Implementing custom I/O mappings, simple protocol converters and timing logic using the device’s 68 I/Os and programmable fabric.
Unique Advantages
- Balanced Logic Density: 6,144 logic elements and roughly 250,000 gates provide a mid-range capacity suitable for compact to moderately complex designs.
- On-chip Memory: Approximately 36.9 kbits of embedded RAM supports buffering and small data tables without external memory.
- Industrial-grade Thermal Range: Specified operation from −40°C to 100°C enables deployment in industrial environments where extended temperature tolerance is required.
- Compact Surface-mount Package: 100-TQFP / 100-VQFP (14×14) options allow dense PCB placement while providing a high I/O count for peripheral interfacing.
- Defined Core Supply: A narrow core voltage range (1.425 V to 1.575 V) simplifies power-rail design and helps ensure predictable device behavior.
- Regulatory Readiness: RoHS compliant construction supports environmental regulatory requirements.
Why Choose A3P250-2VQ100I?
The A3P250-2VQ100I delivers a practical mix of logic resources, on-chip memory and I/O capacity in a compact surface-mount package targeted at industrial and embedded designs. Its combination of 6,144 logic elements, 68 I/Os and defined supply and temperature specifications makes it suitable for systems that need moderate programmable logic integration with predictable thermal and power characteristics.
Manufactured by Microchip Technology as part of the ProASIC3 family, this device provides a reliable, mid-density FPGA option for engineers looking to consolidate logic functions, implement custom interfaces or add programmable control to industrial and embedded products.
Request a quote or submit an inquiry for pricing and availability for the A3P250-2VQ100I to move your design forward.

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