A54SX32-2BG329
| Part Description |
SX Field Programmable Gate Array (FPGA) IC 249 329-BBGA |
|---|---|
| Quantity | 791 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 329-PBGA (31x31) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 329-BBGA | Number of I/O | 249 | Voltage | 3 V - 5.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2880 | Number of Logic Elements/Cells | 2880 | ||
| Number of Gates | 48000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of A54SX32-2BG329 – SX Field Programmable Gate Array (FPGA) IC 249 329-BBGA
The A54SX32-2BG329 is an SX-A family FPGA from Microchip Technology, configured as a nonvolatile, single-chip programmable logic device. It provides 48,000 system gates and approximately 2,880 logic elements with up to 249 user I/Os in a 329-ball BGA package.
Designed for commercial-temperature embedded systems, this device supports mixed-voltage I/O, hot-swap friendliness, and toolbox features for in-system diagnostics and boundary-scan testing—making it suitable for board-level programmable logic, interface bridging, and control functions where nonvolatile configuration and high I/O count are required.
Key Features
- Core Capacity — 48,000 system gates and 2,880 logic elements provide substantial combinatorial and registered logic resources for medium-complexity designs.
- I/O and Interface Flexibility — Up to 249 user I/Os with configurable I/O support for 5 V TTL/PCI, 3.3 V LVTTL, and 2.5 V LVCMOS; supports mixed-voltage operation and 5 V input tolerance/drive.
- Performance — SX-A family performance characteristics include up to 250 MHz system performance and up to 350 MHz internal performance (family-level specification).
- Nonvolatile Single-Chip Solution — Device retains configuration without external memory, simplifying system design and reducing BOM.
- Speed Grade — The “-2” speed grade indicates approximately 25% faster performance than standard (family-level speed grade definition).
- Power and Supply — Supports a wide voltage supply range from 3.0 V to 5.25 V and is power-up/power-down friendly (no sequencing required for supply voltages, family-level feature).
- Package and Mounting — 329-ball BGA (supplier package: 329-PBGA, 31 × 31) in a surface-mount form factor for high I/O density and compact board footprint.
- System Reliability & Testability — Boundary-scan testing compliant with IEEE 1149.1 (JTAG) and in-system diagnostic/verification capability available via Silicon Explorer II (family-level feature).
- Security Features — Includes Actel Secure Programming Technology with FuseLock™ to protect designs from reverse engineering (family-level feature).
- Environmental & Grade — Commercial grade operation from 0 °C to 70 °C and RoHS compliant.
- On-Chip Memory — Total RAM Bits: 0 (no embedded RAM on this device).
Typical Applications
- PCI and Bus Interface Logic — 66 MHz PCI compliance at the family level and high I/O count enable implementation of board-level interface bridging and protocol conversion functions.
- Mixed-Voltage I/O Systems — Configurable 5 V/3.3 V/2.5 V I/O and 5 V tolerance support mixed-voltage interfaces and legacy peripheral integration.
- Nonvolatile Configuration Logic — Single-chip nonvolatile architecture is suited for designs that require on-board programmable logic without external configuration memory.
- Boundary-Scan and Board Bring-Up — Built-in JTAG boundary-scan and in-system diagnostics assist manufacturing test and field debugging workflows.
Unique Advantages
- High I/O Density: 249 user I/Os in a 329-ball BGA package enables dense connectivity for complex board-level functions.
- Nonvolatile, Single-Chip Deployment: Eliminates the need for external configuration memory, reducing BOM and simplifying system power sequencing.
- Mixed-Voltage Flexibility: Configurable I/O standards and 5 V tolerance allow the device to interface directly with a wide range of legacy and modern signals.
- Deterministic Timing and Performance Headroom: Family-level performance specs (up to 250 MHz system / 350 MHz internal) and user-controllable timing afford predictable timing closure for critical paths.
- Built-In Security and Test: FuseLock programming and IEEE 1149.1 boundary-scan support protect IP and streamline testability during production and service.
- Commercial-Grade Reliability: Specified for 0 °C to 70 °C operation and RoHS compliant to meet standard commercial product requirements.
Why Choose A54SX32-2BG329?
The A54SX32-2BG329 combines a sizeable logic resource set (48,000 gates / 2,880 logic elements) with a high I/O count and nonvolatile single-chip configuration to deliver a compact, board-friendly FPGA solution for commercial embedded designs. Its mixed-voltage I/O support and BGA packaging provide integration flexibility while reducing external components.
Choose this device when you need medium-complexity programmable logic with in-system diagnostic capability, boundary-scan test support, and secure programming features. Its commercial temperature rating and RoHS compliance make it suitable for a wide range of standard embedded applications requiring reliable, reprogrammable logic in a compact form factor.
Request a quote or contact sales to discuss pricing, lead times, and integration support for the A54SX32-2BG329.

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