A54SX32-2BGG329

IC FPGA 249 I/O 329BGA
Part Description

SX Field Programmable Gate Array (FPGA) IC 249 329-BBGA

Quantity 1,174 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package329-PBGA (31x31)GradeCommercialOperating Temperature0°C – 70°C
Package / Case329-BBGANumber of I/O249Voltage3 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2880Number of Logic Elements/Cells2880
Number of Gates48000ECCN3A991DHTS Code8542.39.0001
QualificationN/A

Overview of A54SX32-2BGG329 – SX Field Programmable Gate Array (FPGA) IC 249 329-BBGA

The A54SX32-2BGG329 is a nonvolatile SX-family FPGA from Microchip Technology designed for applications requiring programmable logic with persistent configuration. It provides 48,000 system gates and 2,880 logic elements in a surface-mount 329-ball BGA package, combined with up to 249 user I/O pins and mixed-voltage I/O support.

This device targets designers who need a single-chip programmable solution with configurable I/O, JTAG boundary-scan, and features drawn from the SX-A family such as hot-swap‑compliant I/Os and in-system diagnostic capability.

Key Features

  • Logic Capacity — Approximately 48,000 system gates implemented as 2,880 logic elements (combinatorial cells and registers) for mid-range logic integration.
  • User I/O and Voltage Support — Up to 249 user I/Os with configurable support for 3.3 V / 5 V PCI, 5 V TTL, 3.3 V LVTTL and 2.5 V LVCMOS2; supports mixed-voltage operation with 5 V input tolerance and 5 V drive strength.
  • Performance — SX-family performance characteristics include system performance up to 250 MHz and internal performance up to 350 MHz as documented for the family.
  • Nonvolatile Single-Chip Architecture — Nonvolatile configuration on a single chip removes the need for external configuration memory at power-up.
  • I/O Robustness — Hot-swap‑compliant I/Os and configurable weak pull-up/pull-down options for defined behavior at power-up; individual output slew-rate control.
  • Security and Test — Boundary-scan (IEEE 1149.1) and Actel Secure Programming Technology with FuseLock for design protection and anti-reverse-engineering measures (family-level feature).
  • Package and Mounting — 329-ball PBGA-style package in a surface-mount form factor (supplier package listed as 329‑PBGA, 31×31) and RoHS compliant.
  • Electrical and Environmental — Voltage supply range 3 V to 5.25 V and commercial operating temperature 0 °C to 70 °C.
  • Speed Grade — Specified in a –2 speed grade for this part number (family documentation indicates –2 corresponds to approximately 25% faster than standard).
  • On-Chip Memory — No embedded RAM bits reported for this device (total on-chip RAM bits: 0).

Typical Applications

  • PCI-enabled systems — Use where 66 MHz PCI compliance and configurable 3.3 V/5 V PCI I/O are required for interface logic and bridging.
  • Mixed-voltage digital I/O — Ideal for designs that need mixed-voltage interfacing and 5 V tolerant I/Os with selectable I/O standards.
  • Secure programmable logic — Applications that require nonvolatile configuration and protection against reverse engineering using the family’s secure programming technology.
  • In-system diagnostics and verification — Systems that benefit from boundary-scan and in-system diagnostic capabilities for production test and troubleshooting.

Unique Advantages

  • Integrated nonvolatile configuration — Eliminates the need for external configuration memory, simplifying board design and reducing BOM count.
  • Flexible I/O standards — Configurable I/O support across multiple voltage standards and 5 V tolerance reduces the need for level translators in mixed-voltage systems.
  • High usable I/O count — Up to 249 user I/Os in a compact 329-ball BGA package supports dense peripheral interfacing.
  • Device-level security — Family-level secure programming and FuseLock technology provide protection for IP implemented in the device.
  • Test and debug support — Boundary-scan (IEEE 1149.1) and in-system diagnostic capability assist production testing and field verification.
  • Commercial-grade reliability — Specified commercial temperature range (0 °C to 70 °C) and RoHS-compliant packaging for standard commercial applications.

Why Choose A54SX32-2BGG329?

The A54SX32-2BGG329 combines a mid-range logic density (approximately 48,000 system gates and 2,880 logic elements) with a high I/O count and flexible mixed-voltage I/O support, making it well suited to designs that need persistent configuration, multiple I/O standards, and production testability. Its nonvolatile single-chip architecture and family-provided security features reduce external parts and help protect design IP.

This device is appropriate for commercial embedded designs requiring a programmable, in-system configurable logic element with robust I/O options and boundary-scan/test support. The combination of package density, I/O flexibility, and family-level diagnostics supports scalable, maintainable designs with long-term product support from the manufacturer.

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