A54SX32-2BGG329
| Part Description |
SX Field Programmable Gate Array (FPGA) IC 249 329-BBGA |
|---|---|
| Quantity | 1,174 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 329-PBGA (31x31) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 329-BBGA | Number of I/O | 249 | Voltage | 3 V - 5.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2880 | Number of Logic Elements/Cells | 2880 | ||
| Number of Gates | 48000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of A54SX32-2BGG329 – SX Field Programmable Gate Array (FPGA) IC 249 329-BBGA
The A54SX32-2BGG329 is a nonvolatile SX-family FPGA from Microchip Technology designed for applications requiring programmable logic with persistent configuration. It provides 48,000 system gates and 2,880 logic elements in a surface-mount 329-ball BGA package, combined with up to 249 user I/O pins and mixed-voltage I/O support.
This device targets designers who need a single-chip programmable solution with configurable I/O, JTAG boundary-scan, and features drawn from the SX-A family such as hot-swap‑compliant I/Os and in-system diagnostic capability.
Key Features
- Logic Capacity — Approximately 48,000 system gates implemented as 2,880 logic elements (combinatorial cells and registers) for mid-range logic integration.
- User I/O and Voltage Support — Up to 249 user I/Os with configurable support for 3.3 V / 5 V PCI, 5 V TTL, 3.3 V LVTTL and 2.5 V LVCMOS2; supports mixed-voltage operation with 5 V input tolerance and 5 V drive strength.
- Performance — SX-family performance characteristics include system performance up to 250 MHz and internal performance up to 350 MHz as documented for the family.
- Nonvolatile Single-Chip Architecture — Nonvolatile configuration on a single chip removes the need for external configuration memory at power-up.
- I/O Robustness — Hot-swap‑compliant I/Os and configurable weak pull-up/pull-down options for defined behavior at power-up; individual output slew-rate control.
- Security and Test — Boundary-scan (IEEE 1149.1) and Actel Secure Programming Technology with FuseLock for design protection and anti-reverse-engineering measures (family-level feature).
- Package and Mounting — 329-ball PBGA-style package in a surface-mount form factor (supplier package listed as 329‑PBGA, 31×31) and RoHS compliant.
- Electrical and Environmental — Voltage supply range 3 V to 5.25 V and commercial operating temperature 0 °C to 70 °C.
- Speed Grade — Specified in a –2 speed grade for this part number (family documentation indicates –2 corresponds to approximately 25% faster than standard).
- On-Chip Memory — No embedded RAM bits reported for this device (total on-chip RAM bits: 0).
Typical Applications
- PCI-enabled systems — Use where 66 MHz PCI compliance and configurable 3.3 V/5 V PCI I/O are required for interface logic and bridging.
- Mixed-voltage digital I/O — Ideal for designs that need mixed-voltage interfacing and 5 V tolerant I/Os with selectable I/O standards.
- Secure programmable logic — Applications that require nonvolatile configuration and protection against reverse engineering using the family’s secure programming technology.
- In-system diagnostics and verification — Systems that benefit from boundary-scan and in-system diagnostic capabilities for production test and troubleshooting.
Unique Advantages
- Integrated nonvolatile configuration — Eliminates the need for external configuration memory, simplifying board design and reducing BOM count.
- Flexible I/O standards — Configurable I/O support across multiple voltage standards and 5 V tolerance reduces the need for level translators in mixed-voltage systems.
- High usable I/O count — Up to 249 user I/Os in a compact 329-ball BGA package supports dense peripheral interfacing.
- Device-level security — Family-level secure programming and FuseLock technology provide protection for IP implemented in the device.
- Test and debug support — Boundary-scan (IEEE 1149.1) and in-system diagnostic capability assist production testing and field verification.
- Commercial-grade reliability — Specified commercial temperature range (0 °C to 70 °C) and RoHS-compliant packaging for standard commercial applications.
Why Choose A54SX32-2BGG329?
The A54SX32-2BGG329 combines a mid-range logic density (approximately 48,000 system gates and 2,880 logic elements) with a high I/O count and flexible mixed-voltage I/O support, making it well suited to designs that need persistent configuration, multiple I/O standards, and production testability. Its nonvolatile single-chip architecture and family-provided security features reduce external parts and help protect design IP.
This device is appropriate for commercial embedded designs requiring a programmable, in-system configurable logic element with robust I/O options and boundary-scan/test support. The combination of package density, I/O flexibility, and family-level diagnostics supports scalable, maintainable designs with long-term product support from the manufacturer.
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