A54SX32-2BG329I

IC FPGA 249 I/O 329BGA
Part Description

SX Field Programmable Gate Array (FPGA) IC 249 329-BBGA

Quantity 725 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package329-PBGA (31x31)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case329-BBGANumber of I/O249Voltage3 V - 5.5 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2880Number of Logic Elements/Cells2880
Number of Gates48000ECCN3A991DHTS Code8542.39.0001
QualificationN/A

Overview of A54SX32-2BG329I – SX Field Programmable Gate Array (FPGA) IC 249 329-BBGA

The A54SX32-2BG329I is a member of the SX-A family of nonvolatile, single‑chip FPGAs. It delivers a balance of mid-range gate capacity and flexible I/O in a 329-ball BGA package, targeting embedded and industrial designs that require deterministic timing, mixed‑voltage I/O support, and robust package options.

Built for applications that need up to 48,000 system gates with 2,880 logic elements and 249 user I/Os, this device provides series features such as hot‑swap compliant I/Os, configurable I/O standards, and security features from the SX-A family.

Key Features

  • Logic Capacity — 2,880 logic elements (logic modules) and approximately 48,000 system gates for mid‑range logic integration.
  • User I/O — 249 user I/O pins, supporting configurable I/O for multiple voltage standards as documented for the SX‑A family.
  • Nonvolatile Single‑Chip Architecture — SX‑A family nonvolatile configuration eliminates the need for external configuration memory.
  • Performance — Series‑level performance indicators include up to 250 MHz system performance and up to 350 MHz internal performance (SX‑A family figures).
  • Mixed‑Voltage and I/O Flexibility — Family support for 2.5 V, 3.3 V, and 5 V mixed‑voltage operation with 5 V input tolerance and selectable output drive strength.
  • Power and Reliability — Power‑up/down friendly operation (no supply sequencing required) and hot‑swap compatible I/Os as specified for the SX‑A family.
  • Security and Test — Actel Secure Programming Technology with FuseLock™ to help protect design IP; boundary‑scan (JTAG) testing supported per the SX‑A family.
  • Package and Mounting — Surface‑mount 329‑BBGA package; supplier device package listed as 329‑PBGA (31×31).
  • Voltage and Temperature — Voltage supply range 3 V to 5.5 V; industrial operating temperature range −40 °C to 85 °C; device grade: Industrial.
  • RoHS Compliant — Device is RoHS compliant.

Typical Applications

  • Industrial Control — Deterministic timing and 249 I/Os enable real‑time control, sensor aggregation, and I/O‑dense interface tasks in industrial equipment.
  • Communications and Networking — Mid‑range gate count and flexible I/O lend themselves to protocol bridging, packet parsing, and interface adaptation.
  • Instrumentation and Test Equipment — Nonvolatile configuration and boundary‑scan support simplify deployment and in‑system diagnostics for measurement systems.

Unique Advantages

  • Balanced Integration: 2,880 logic elements and ~48,000 system gates provide significant on‑chip logic without requiring large, power‑hungry devices.
  • Flexible I/O Standards: Configurable I/O and mixed‑voltage operation enable direct interfacing to 5 V TTL, 3.3 V LVTTL, and 2.5 V LVCMOS2 systems.
  • Nonvolatile, Single‑Chip Solution: Eliminates external configuration memory and simplifies board design and system initialization.
  • Design Security: Built‑in FuseLock™ secure programming technology helps prevent reverse engineering and protect IP.
  • Industrial Reliability: Industrial temperature grade (−40 °C to 85 °C) and hot‑swap capable I/Os support deployment in demanding environments.
  • Testability and Diagnostics: Boundary‑scan (IEEE 1149.1) and family diagnostic features support in‑system testing and verification.

Why Choose A54SX32-2BG329I?

The A54SX32-2BG329I delivers mid‑range logic density and extensive I/O in a compact 329‑ball BGA package, combined with the SX‑A family’s nonvolatile architecture and security features. Its mixed‑voltage I/O support, hot‑swap capability, and industrial temperature rating make it suitable for embedded and industrial designs that require reliable, deterministic operation and IP protection.

This device is ideal for engineers and teams building control systems, communications interfaces, or instrumentation where single‑chip configurability, secure programming, and flexible I/O reduce BOM complexity and simplify system integration.

Request a quote or submit an inquiry for pricing and availability for the A54SX32-2BG329I to begin evaluating this FPGA for your design.

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