A54SX32A-1BGG329M

IC FPGA 249 I/O 329BGA
Part Description

SX-A Field Programmable Gate Array (FPGA) IC 249 329-BBGA

Quantity 1,060 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package329-PBGA (31x31)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case329-BBGANumber of I/O249Voltage2.25 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2880Number of Logic Elements/Cells2880
Number of Gates48000ECCN3A001A2CHTS Code8542.39.0001
QualificationN/A

Overview of A54SX32A-1BGG329M – SX-A Field Programmable Gate Array (FPGA) IC 249 329-BBGA

The A54SX32A-1BGG329M is a military-grade SX-A family FPGA provided in a 329-ball BGA package. It combines nonvolatile single-chip FPGA architecture with high I/O density and a wide operating temperature range for rugged, mission-critical designs.

Designed for applications that require secure, high-density logic and flexible interfacing, this device offers 48,000 system gates and 2,880 logic elements with a 249-pin I/O count, supporting mixed-voltage operation and supplier-standard BGA packaging.

Key Features

  • Logic Capacity — 48,000 system gates and approximately 2,880 logic elements for implementing complex logic functions and state machines.
  • User I/O and Voltage Flexibility — 249 user I/Os with family-level support for configurable I/O standards and mixed-voltage operation; device supply range 2.25 V to 5.25 V for flexible board-level integration.
  • Nonvolatile Single-Chip Architecture — SX-A family nonvolatile configuration eliminates the need for external configuration memory and supports reliable power-up behavior.
  • Performance (SX-A Family) — SX-A family data indicates system performance up to 250 MHz and internal performance up to 350 MHz for timing-sensitive designs.
  • Security and Test — Family features include Actel Secure Programming Technology (FuseLock™) to protect design IP and IEEE 1149.1 (JTAG) boundary-scan support for board-level testability.
  • Rugged Packaging and Mounting — Supplied in a 329-PBGA (31 × 31 mm) surface-mount package (329-BBGA case) suitable for compact, high-density PCB layouts.
  • Wide Temperature Range — Military-grade operating temperature from −55 °C to +125 °C for deployment in harsh environments.
  • Regulatory — RoHS compliant.
  • On-chip Memory — No embedded RAM bits; design flows should account for off-chip memory if required.

Typical Applications

  • Military and Aerospace Systems — Military temperature grade and nonvolatile configuration make the device suitable for rugged avionics, tactical electronics, and other defense applications.
  • Secure Embedded Logic — Built-in programming security (FuseLock™) and single-chip configuration support secure implementations where IP protection and controlled provisioning matter.
  • High-Density Interface Bridging — 249 user I/Os and mixed-voltage support allow consolidation of multiple interfaces and protocol bridging on a single FPGA.
  • Deterministic Control and Timing — Family-level performance characteristics and deterministic timing features are well suited for embedded control, instrumentation, and timing-sensitive subsystems.

Unique Advantages

  • Military-Grade Reliability: Qualified for −55 °C to +125 °C operation, supporting deployments in extreme environments.
  • High I/O Count: 249 user I/Os enable complex system integration and reduce the need for additional interface components.
  • Nonvolatile, Single-Chip Solution: Eliminates external configuration memory, simplifying power sequencing and improving system robustness.
  • Flexible Supply Range: 2.25 V to 5.25 V supply range provides design flexibility across different board-level voltage architectures.
  • Design Security and Testability: FuseLock™ secure programming and IEEE 1149.1 JTAG support protect IP and facilitate boundary-scan testing.
  • Compact BGA Packaging: 329-ball PBGA (31 × 31 mm) package delivers high pin count in a compact footprint for space-constrained systems.

Why Choose A54SX32A-1BGG329M?

The A54SX32A-1BGG329M targets designs that require a robust, nonvolatile FPGA with high I/O density and military-grade temperature performance. With 48,000 system gates, approximately 2,880 logic elements, and 249 user I/Os, it supports complex logic integration and interface consolidation while operating across a wide supply range (2.25 V–5.25 V).

Its single-chip nonvolatile architecture, programmable security features, and RoHS compliance deliver long-term reliability and IP protection for demanding applications where environmental tolerance and secure provisioning are priorities.

Request a quote or submit an inquiry to our sales team for pricing, availability, and lead-time information on the A54SX32A-1BGG329M.

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