A54SX32A-1BGG329

IC FPGA 249 I/O 329BGA
Part Description

SX-A Field Programmable Gate Array (FPGA) IC 249 329-BBGA

Quantity 1,859 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package329-PBGA (31x31)GradeCommercialOperating Temperature0°C – 70°C
Package / Case329-BBGANumber of I/O249Voltage2.25 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2880Number of Logic Elements/Cells2880
Number of Gates48000ECCN3A991DHTS Code8542.39.0001
QualificationN/A

Overview of A54SX32A-1BGG329 – SX-A Field Programmable Gate Array (FPGA) IC 249 329-BBGA

The A54SX32A-1BGG329 is a member of the SX-A family of nonvolatile single-chip FPGAs from Microchip Technology. It delivers approximately 48,000 system gates and 2,880 logic elements with up to 249 user-programmable I/Os, packaged in a 329-ball BGA.

Designed for commercial embedded designs that require flexible I/O, mixed-voltage support and nonvolatile configuration, the device combines deterministic timing and hardware security features from the SX-A family with a wide supply-voltage operating range and RoHS-compliant packaging.

Key Features

  • Logic Capacity  Approximately 48,000 system gates and 2,880 logic elements support moderate-complexity glue logic and control functions.
  • User I/O  Up to 249 user-programmable I/O pins provide extensive interface options for peripherals, sensors and buses.
  • Nonvolatile Single-Chip Architecture  Series-level SX-A family capability: single-chip nonvolatile configuration eliminates external configuration memory and simplifies system startup.
  • Flexible I/O Voltage Support  Series-level configurable I/O supports multiple interface voltages and modes; device supply range is 2.25 V to 5.25 V for mixed-voltage designs.
  • Performance  Series-level SX-A performance characteristics include high internal and system frequency targets, suitable for demanding timing needs within the family’s specified grades.
  • Security & Test  Series-level features include boundary-scan (JTAG) support and Actel Secure Programming Technology (FuseLock™) for design protection and in-system verification.
  • Package & Mounting  329-ball BGA package (Supplier package: 329-PBGA (31x31)), surface-mount mounting for compact board-level integration.
  • Commercial Temperature Grade  Rated for 0 °C to 70 °C operation, suitable for commercial-grade embedded products.
  • Regulatory  RoHS-compliant packaging.
  • On-Chip Memory  Total on-chip RAM bits: 0 (device provides logic and flip-flop resources without embedded RAM).

Typical Applications

  • Embedded Control and Glue Logic  Use the FPGA’s 2,880 logic elements and 249 I/Os to consolidate discrete glue logic, protocol translation and control functions on a single chip.
  • Interface and Peripheral Concentration  High I/O count and mixed-voltage support enable integration of multiple peripheral interfaces and level translation tasks in commercial systems.
  • PCI-Related and High-Speed I/O  Series-level support for PCI signaling and high internal/system performance make the device suitable for board-level interfacing and bus bridging in commercial applications.
  • Security-Sensitive Designs  Built-in programming protection and in-system diagnostic capabilities help protect IP and support field verification workflows.

Unique Advantages

  • Nonvolatile, single-chip solution: Eliminates external configuration memory, simplifying BOM and board layout.
  • High I/O density: 249 user I/Os provide flexibility to connect multiple peripherals without additional interface chips.
  • Wide supply-voltage compatibility: 2.25 V to 5.25 V device supply supports mixed-voltage designs and diverse I/O standards.
  • Commercial temperature suitability: Rated 0 °C to 70 °C to match commercial embedded product requirements.
  • Package suited for dense designs: 329-ball BGA (329-PBGA (31x31)) offers a compact, high-pin-count footprint for space-constrained boards.
  • RoHS compliance: Packaging meets RoHS requirements for lead-free assembly and environmental compliance.

Why Choose A54SX32A-1BGG329?

The A54SX32A-1BGG329 positions itself as a compact, I/O-rich nonvolatile FPGA for commercial embedded systems that need moderate logic capacity and extensive interfacing. With approximately 48,000 system gates, 2,880 logic elements and 249 user I/Os in a 329-ball BGA, it consolidates control, interface and security functions while simplifying board-level configuration and start-up.

Engineers building commercial electronic products will find this device useful where nonvolatile configuration, mixed-voltage I/O support and a compact package are priorities. Its feature set provides a balance of integration and deterministic behavior appropriate for a range of embedded applications.

Request a quote or submit an RFQ to receive pricing and availability for the A54SX32A-1BGG329.

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