A54SX32A-1BGG329
| Part Description |
SX-A Field Programmable Gate Array (FPGA) IC 249 329-BBGA |
|---|---|
| Quantity | 1,859 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 329-PBGA (31x31) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 329-BBGA | Number of I/O | 249 | Voltage | 2.25 V - 5.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2880 | Number of Logic Elements/Cells | 2880 | ||
| Number of Gates | 48000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of A54SX32A-1BGG329 – SX-A Field Programmable Gate Array (FPGA) IC 249 329-BBGA
The A54SX32A-1BGG329 is a member of the SX-A family of nonvolatile single-chip FPGAs from Microchip Technology. It delivers approximately 48,000 system gates and 2,880 logic elements with up to 249 user-programmable I/Os, packaged in a 329-ball BGA.
Designed for commercial embedded designs that require flexible I/O, mixed-voltage support and nonvolatile configuration, the device combines deterministic timing and hardware security features from the SX-A family with a wide supply-voltage operating range and RoHS-compliant packaging.
Key Features
- Logic Capacity Approximately 48,000 system gates and 2,880 logic elements support moderate-complexity glue logic and control functions.
- User I/O Up to 249 user-programmable I/O pins provide extensive interface options for peripherals, sensors and buses.
- Nonvolatile Single-Chip Architecture Series-level SX-A family capability: single-chip nonvolatile configuration eliminates external configuration memory and simplifies system startup.
- Flexible I/O Voltage Support Series-level configurable I/O supports multiple interface voltages and modes; device supply range is 2.25 V to 5.25 V for mixed-voltage designs.
- Performance Series-level SX-A performance characteristics include high internal and system frequency targets, suitable for demanding timing needs within the family’s specified grades.
- Security & Test Series-level features include boundary-scan (JTAG) support and Actel Secure Programming Technology (FuseLock™) for design protection and in-system verification.
- Package & Mounting 329-ball BGA package (Supplier package: 329-PBGA (31x31)), surface-mount mounting for compact board-level integration.
- Commercial Temperature Grade Rated for 0 °C to 70 °C operation, suitable for commercial-grade embedded products.
- Regulatory RoHS-compliant packaging.
- On-Chip Memory Total on-chip RAM bits: 0 (device provides logic and flip-flop resources without embedded RAM).
Typical Applications
- Embedded Control and Glue Logic Use the FPGA’s 2,880 logic elements and 249 I/Os to consolidate discrete glue logic, protocol translation and control functions on a single chip.
- Interface and Peripheral Concentration High I/O count and mixed-voltage support enable integration of multiple peripheral interfaces and level translation tasks in commercial systems.
- PCI-Related and High-Speed I/O Series-level support for PCI signaling and high internal/system performance make the device suitable for board-level interfacing and bus bridging in commercial applications.
- Security-Sensitive Designs Built-in programming protection and in-system diagnostic capabilities help protect IP and support field verification workflows.
Unique Advantages
- Nonvolatile, single-chip solution: Eliminates external configuration memory, simplifying BOM and board layout.
- High I/O density: 249 user I/Os provide flexibility to connect multiple peripherals without additional interface chips.
- Wide supply-voltage compatibility: 2.25 V to 5.25 V device supply supports mixed-voltage designs and diverse I/O standards.
- Commercial temperature suitability: Rated 0 °C to 70 °C to match commercial embedded product requirements.
- Package suited for dense designs: 329-ball BGA (329-PBGA (31x31)) offers a compact, high-pin-count footprint for space-constrained boards.
- RoHS compliance: Packaging meets RoHS requirements for lead-free assembly and environmental compliance.
Why Choose A54SX32A-1BGG329?
The A54SX32A-1BGG329 positions itself as a compact, I/O-rich nonvolatile FPGA for commercial embedded systems that need moderate logic capacity and extensive interfacing. With approximately 48,000 system gates, 2,880 logic elements and 249 user I/Os in a 329-ball BGA, it consolidates control, interface and security functions while simplifying board-level configuration and start-up.
Engineers building commercial electronic products will find this device useful where nonvolatile configuration, mixed-voltage I/O support and a compact package are priorities. Its feature set provides a balance of integration and deterministic behavior appropriate for a range of embedded applications.
Request a quote or submit an RFQ to receive pricing and availability for the A54SX32A-1BGG329.

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