A54SX32A-1BGG329I
| Part Description |
SX-A Field Programmable Gate Array (FPGA) IC 249 329-BBGA |
|---|---|
| Quantity | 347 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 329-PBGA (31x31) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 329-BBGA | Number of I/O | 249 | Voltage | 2.25 V - 5.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2880 | Number of Logic Elements/Cells | 2880 | ||
| Number of Gates | 48000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of A54SX32A-1BGG329I – SX-A FPGA, 249 I/O, 329-BBGA
The A54SX32A-1BGG329I is a nonvolatile SX-A family Field Programmable Gate Array (FPGA) in a 329-ball BGA package optimized for mixed-voltage embedded designs. It delivers 48,000 system gates with 2,880 logic elements and up to 249 user-programmable I/Os, targeting industrial applications that require deterministic timing, dense I/O and robust configuration security.
Built for mixed-voltage systems, the device supports 2.25 V to 5.25 V supplies and an industrial operating range of −40 °C to +85 °C. Family-level characteristics include up to 250 MHz system performance and up to 350 MHz internal performance, nonvolatile single-chip configuration, and on-chip features for in-system diagnostics and boundary-scan testing.
Key Features
- Core Capacity 48,000 system gates implemented as approximately 2,880 logic elements and up to 2,012 dedicated flip-flops for combinational and sequential logic.
- High I/O Density Up to 249 user-programmable I/Os to support high-pin-count interfaces in a single device.
- Performance Family-level system performance up to 250 MHz and internal performance up to 350 MHz for timing-sensitive logic.
- Mixed-Voltage I/O Configurable I/O support for 2.5 V, 3.3 V and 5 V signaling, including 5 V input tolerance and 5 V drive strength where applicable.
- Power and Hot-Swap Hot-swap compliant I/Os and power-up/power-down friendly behavior with no sequencing required for supply voltages.
- Configuration & Security Nonvolatile, single‑chip configuration with Actel Secure Programming Technology (FuseLock) to protect design IP.
- Test and Diagnostics IEEE 1149.1 (JTAG) boundary-scan support and in-system diagnostic/verification capability for board-level validation.
- Package & Temperature 329-ball PBGA (31 × 31 mm) package; industrial temperature grade rated from −40 °C to +85 °C.
- Standards & Compatibility 66 MHz PCI-compliant I/O option and configurable weak pull-up/pull-down on I/O at power-up.
- Regulatory RoHS-compliant packaging.
Typical Applications
- PCI-based systems — Implements programmable interfaces and glue logic for 66 MHz PCI or mixed-voltage I/O subsystems.
- Industrial control and automation — Provides deterministic timing and wide I/O count for sensor aggregation, motor control interfaces, and field I/O expansion within industrial temperature ranges.
- In-system test and verification — Integrates boundary-scan (IEEE 1149.1) and in-system diagnostics to simplify board bring-up and fault isolation.
- Mixed-voltage embedded designs — Supports 2.5 V, 3.3 V and 5 V signaling options to interface with a broad range of legacy and modern peripherals.
Unique Advantages
- Nonvolatile single-chip solution: Eliminates external configuration memory, simplifying system design and reducing BOM.
- High I/O and logic density: 249 I/Os combined with 2,880 logic elements enable complex, high-pin-count implementations in a single device.
- Mixed-voltage flexibility: Configurable I/O levels and 5 V tolerance support interfacing across different subsystems without level-shifting components.
- Robust configuration security: FuseLock technology helps protect design IP against reverse engineering.
- Testability and diagnostics: JTAG boundary-scan and in-system diagnostic capability reduce development time and improve serviceability.
- Industrial reliability: Rated for −40 °C to +85 °C operation to meet demanding embedded and industrial environments.
Why Choose A54SX32A-1BGG329I?
The A54SX32A-1BGG329I positions itself as a versatile SX-A family FPGA with a balance of logic capacity, high I/O count and mixed-voltage I/O support suited for industrial embedded designs. With nonvolatile single-chip configuration, deterministic timing characteristics, and built-in diagnostics and security features, the device is appropriate for applications that require reliable, configurable hardware with strong board-level testability.
This part is ideal for designers needing a compact, high-I/O FPGA in a 329-ball PBGA package with industrial temperature performance and RoHS-compliant packaging. Its combination of performance figures, I/O flexibility and security features supports scalable designs that benefit from reduced system complexity and improved maintainability.
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