A54SX32A-1BGG329I

IC FPGA 249 I/O 329BGA
Part Description

SX-A Field Programmable Gate Array (FPGA) IC 249 329-BBGA

Quantity 347 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package329-PBGA (31x31)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case329-BBGANumber of I/O249Voltage2.25 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2880Number of Logic Elements/Cells2880
Number of Gates48000ECCN3A991DHTS Code8542.39.0001
QualificationN/A

Overview of A54SX32A-1BGG329I – SX-A FPGA, 249 I/O, 329-BBGA

The A54SX32A-1BGG329I is a nonvolatile SX-A family Field Programmable Gate Array (FPGA) in a 329-ball BGA package optimized for mixed-voltage embedded designs. It delivers 48,000 system gates with 2,880 logic elements and up to 249 user-programmable I/Os, targeting industrial applications that require deterministic timing, dense I/O and robust configuration security.

Built for mixed-voltage systems, the device supports 2.25 V to 5.25 V supplies and an industrial operating range of −40 °C to +85 °C. Family-level characteristics include up to 250 MHz system performance and up to 350 MHz internal performance, nonvolatile single-chip configuration, and on-chip features for in-system diagnostics and boundary-scan testing.

Key Features

  • Core Capacity 48,000 system gates implemented as approximately 2,880 logic elements and up to 2,012 dedicated flip-flops for combinational and sequential logic.
  • High I/O Density Up to 249 user-programmable I/Os to support high-pin-count interfaces in a single device.
  • Performance Family-level system performance up to 250 MHz and internal performance up to 350 MHz for timing-sensitive logic.
  • Mixed-Voltage I/O Configurable I/O support for 2.5 V, 3.3 V and 5 V signaling, including 5 V input tolerance and 5 V drive strength where applicable.
  • Power and Hot-Swap Hot-swap compliant I/Os and power-up/power-down friendly behavior with no sequencing required for supply voltages.
  • Configuration & Security Nonvolatile, single‑chip configuration with Actel Secure Programming Technology (FuseLock) to protect design IP.
  • Test and Diagnostics IEEE 1149.1 (JTAG) boundary-scan support and in-system diagnostic/verification capability for board-level validation.
  • Package & Temperature 329-ball PBGA (31 × 31 mm) package; industrial temperature grade rated from −40 °C to +85 °C.
  • Standards & Compatibility 66 MHz PCI-compliant I/O option and configurable weak pull-up/pull-down on I/O at power-up.
  • Regulatory RoHS-compliant packaging.

Typical Applications

  • PCI-based systems — Implements programmable interfaces and glue logic for 66 MHz PCI or mixed-voltage I/O subsystems.
  • Industrial control and automation — Provides deterministic timing and wide I/O count for sensor aggregation, motor control interfaces, and field I/O expansion within industrial temperature ranges.
  • In-system test and verification — Integrates boundary-scan (IEEE 1149.1) and in-system diagnostics to simplify board bring-up and fault isolation.
  • Mixed-voltage embedded designs — Supports 2.5 V, 3.3 V and 5 V signaling options to interface with a broad range of legacy and modern peripherals.

Unique Advantages

  • Nonvolatile single-chip solution: Eliminates external configuration memory, simplifying system design and reducing BOM.
  • High I/O and logic density: 249 I/Os combined with 2,880 logic elements enable complex, high-pin-count implementations in a single device.
  • Mixed-voltage flexibility: Configurable I/O levels and 5 V tolerance support interfacing across different subsystems without level-shifting components.
  • Robust configuration security: FuseLock technology helps protect design IP against reverse engineering.
  • Testability and diagnostics: JTAG boundary-scan and in-system diagnostic capability reduce development time and improve serviceability.
  • Industrial reliability: Rated for −40 °C to +85 °C operation to meet demanding embedded and industrial environments.

Why Choose A54SX32A-1BGG329I?

The A54SX32A-1BGG329I positions itself as a versatile SX-A family FPGA with a balance of logic capacity, high I/O count and mixed-voltage I/O support suited for industrial embedded designs. With nonvolatile single-chip configuration, deterministic timing characteristics, and built-in diagnostics and security features, the device is appropriate for applications that require reliable, configurable hardware with strong board-level testability.

This part is ideal for designers needing a compact, high-I/O FPGA in a 329-ball PBGA package with industrial temperature performance and RoHS-compliant packaging. Its combination of performance figures, I/O flexibility and security features supports scalable designs that benefit from reduced system complexity and improved maintainability.

Request a quote or submit an inquiry to discuss pricing, availability and lead times for the A54SX32A-1BGG329I. Our sales team can provide technical details and support to help integrate this FPGA into your design.

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