A54SX32A-FBG329

IC FPGA 249 I/O 329BGA
Part Description

SX-A Field Programmable Gate Array (FPGA) IC 249 329-BBGA

Quantity 876 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package329-PBGA (31x31)GradeCommercialOperating Temperature0°C – 70°C
Package / Case329-BBGANumber of I/O249Voltage2.25 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2880Number of Logic Elements/Cells2880
Number of Gates48000ECCN3A991DHTS Code8542.39.0001
QualificationN/A

Overview of A54SX32A-FBG329 – SX-A Field Programmable Gate Array (FPGA) IC 249 329-BBGA

The A54SX32A-FBG329 is a nonvolatile SX-A family FPGA from Microchip Technology designed for commercial electronic designs. It provides a mid-range logic capacity with 48,000 system gates, 2,880 logic elements, and up to 249 user-programmable I/O pins in a 329-ball BGA package.

Built for mixed-voltage interfacing and deterministic timing, this device targets applications that require high I/O density, in-system programmability and on-chip security while operating across a broad supply range and standard commercial temperature conditions.

Key Features

  • Logic Capacity — Approximately 48,000 system gates and 2,880 logic elements provide mid-range programmable logic resources for glue logic, control, and interface functions.
  • I/O Density — Up to 249 user-programmable I/O pins enable high-density connectivity for complex board-level interfacing.
  • Performance — Family-level documented performance includes up to 250 MHz system performance and 350 MHz internal performance for timing-critical paths.
  • Nonvolatile Single-Chip Solution — On-chip nonvolatile configuration removes the need for external configuration memory and supports in-system programmability.
  • Mixed-Voltage & I/O Flexibility — Configurable I/O supports 2.5 V, 3.3 V and 5 V signaling with 5 V input tolerance and configurable weak pull-up/pull-down on power-up; individual output slew rate control is supported.
  • Power Handling — Power-up/power-down friendly design requires no sequencing of supply voltages; operates from a 2.25 V to 5.25 V supply range.
  • Standards & Test Support — 66 MHz PCI compliance at the family level and IEEE 1149.1 (JTAG) boundary-scan testing are supported for board-level integration and testability.
  • Security & Diagnostics — Actel Secure Programming Technology with FuseLock™ prevents reverse engineering; in-system diagnostic and verification capability is provided via Silicon Explorer II (family feature).
  • Package & Mounting — Surface-mount 329-BBGA package (supplier device package: 329-PBGA, 31×31) for compact, high-density PCB designs.
  • Temperature & Compliance — Commercial temperature grade (0 °C to 70 °C) and RoHS compliant.
  • On-chip Memory — No embedded RAM bits (Total RAM Bits: 0), enabling deterministic usage of flip-flops and logic elements for control and combinatorial functions.

Typical Applications

  • Interface bridging and protocol adaptation — High I/O count and configurable I/O voltage support make the device suitable for implementing board-level interface logic and protocol glue, including PCI-class signals at 66 MHz.
  • System control and glue logic — The combination of 2,880 logic elements and deterministic timing supports control-state machines, bus arbitration, and other glue logic tasks in commercial electronics.
  • In-system programmable designs — Nonvolatile single-chip configuration and in-system diagnostic features enable field updates and verification in deployed equipment.

Unique Advantages

  • Nonvolatile, single-chip configuration: Eliminates the need for external configuration memory, simplifying BOM and board layout.
  • Flexible mixed-voltage I/O: Configurable support for 2.5 V, 3.3 V and 5 V signaling with 5 V input tolerance reduces the need for level-shifters when interfacing with legacy logic.
  • High I/O count in a compact package: 249 user I/Os in a 329-ball BGA enable dense connectivity in space-constrained designs.
  • Deterministic, testable implementation: Boundary-scan (JTAG) support and family diagnostic tools help streamline board-level bring-up and in-system validation.
  • Security features: FuseLock™ secure programming technology protects design IP and prevents reverse engineering.
  • Power sequencing tolerant: Power-up/down friendly operation removes supply sequencing constraints during system power events.

Why Choose A54SX32A-FBG329?

The A54SX32A-FBG329 delivers a balanced mix of logic capacity, high I/O density, and nonvolatile configuration in a commercially graded FPGA package. Its mixed-voltage I/O flexibility, JTAG test support, and on-chip security features make it a practical choice for commercial embedded designs that require reliable, in-system programmable logic and robust board-level interfacing.

This device is well suited for engineers and procurement teams seeking a compact, testable, and secure FPGA solution within the SX-A family for commercial-temperature applications. Its documented family-level performance and configurable I/O options provide clear implementation trade-offs for system designers.

If you would like pricing, availability, or to request a quote for A54SX32A-FBG329, submit an inquiry or request a quote through your preferred purchasing channel.

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