A54SX32A-FBGG329

The A54SX32A-FBGG329 is a member of the SX‑A family of nonvolatile, single‑chip FPGAs. It delivers a mix of programmable logic, high I/O count and mixed‑voltage I/O support suitable for designs that require configurable interfacing and in‑system programmability.

Key hardware characteristics include 48,000 system gates (2,880 logic elements), up to 249 user I/Os, support for 2.5 V, 3.3 V and 5 V mixed‑voltage operation, and a 329‑ball FBGA package (31 × 31 mm). The device is offered in a commercial temperature grade (0 °C to 70 °C) and is RoHS compliant.

Key Features

• Logic Capacity  Approximately 48,000 system gates realized across 2,880 logic elements and up to 2,880 dedicated flip‑flops for mid‑density programmable logic applications.
• High I/O Count  Up to 249 user‑programmable I/Os to support complex board‑level interfacing and multi‑signal systems.
• Nonvolatile Single‑Chip Architecture  SX‑A family nonvolatile configuration eliminates the need for external configuration memory and supports in‑system programming and diagnostics.
• Mixed‑Voltage I/O and PCI Support  Configurable I/O supports 3.3 V / 5 V PCI, 5 V TTL, 3.3 V LVTTL and 2.5 V LVCMOS2; devices are 66 MHz PCI compliant and offer 5 V input tolerance with 5 V drive strength where supported.
• Performance  Family performance targets include up to 250 MHz system performance and up to 350 MHz internal performance for timing‑sensitive logic functions.
• Power and Board Robustness  Hot‑swap compliant I/Os and power‑up/power‑down friendly operation that requires no sequencing for supply voltages.
• Package and Mounting  329‑ball FBGA (31 × 31 mm) package, surface‑mount mounting type suitable for compact, high‑density boards.
• System Debug and Test  Boundary‑scan testing compliant with IEEE 1149.1 (JTAG) and in‑system diagnostic/verification capability as provided by the SX‑A family tools.
• Design Security and Control  Actel Secure Programming Technology (FuseLock™) to protect designs against reverse engineering and unauthorized duplication.
• Packaging and Compliance  RoHS‑compliant packaging; supplier device package listed as 329‑PBGA (31 × 31 mm).

Typical Applications

• PCI Interface and Bridge Logic  66 MHz PCI compliance and configurable 3.3 V/5 V I/O make the device suitable for PCI interface, bridge and legacy interface implementations.
• Mixed‑Voltage System I/O  High I/O count and mixed‑voltage support allow consolidation of multiple voltage domains and level‑shifting functions on a single FPGA.
• Board‑Level Control and Glue Logic  Use as glue logic or control fabric where a nonvolatile, reprogrammable device with robust I/O is required.
• Manufacturing Test and Verification  Boundary‑scan and in‑system diagnostic capability facilitate board testing and production verification workflows.
• Secure In‑System Programmable Designs  FuseLock technology and nonvolatile configuration support secure, field‑programmable applications that need design protection.

Unique Advantages

• Nonvolatile, single‑chip solution: Eliminates external configuration memory and simplifies board BOM and startup sequencing.
• Flexible mixed‑voltage I/O: Configurable I/O standards and 5 V tolerance enable direct interfacing with a wide range of legacy and modern signaling levels.
• High I/O density: Up to 249 user I/Os enable multi‑signal connectivity without additional interface components.
• Robust board behavior: Hot‑swap compliant I/Os and power‑up/down friendly operation reduce system risk during insertion and power transitions.
• Security and test focus: Built‑in FuseLock programming and IEEE‑1149.1 boundary‑scan support streamline secure deployment and manufacturing test.
• Compact package: 329‑ball FBGA (31 × 31 mm) provides a space‑efficient mounting option for dense PCB layouts.

Why Choose A54SX32A-FBGG329?

The A54SX32A-FBGG329 positions itself as a versatile, mid‑density FPGA option for designs that require a nonvolatile programmable fabric with a high I/O count and mixed‑voltage interfacing. Its combination of approximately 48,000 system gates, 2,880 logic elements and up to 249 I/Os supports consolidating interface logic and control functions into a single, reprogrammable device.

With features such as hot‑swap‑compliant I/Os, PCI compatibility, in‑system diagnostics and FuseLock security, the device is suited to applications where board robustness, testability and design protection are important. Offered in a commercial temperature grade (0 °C to 70 °C) and RoHS‑compliant packaging, it provides a reliable, compact solution for mid‑range embedded and interface designs.

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