A54SX32A-FGG256I

IC FPGA 203 I/O 256FBGA
Part Description

SX-A Field Programmable Gate Array (FPGA) IC 203 256-BGA

Quantity 558 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case256-BGANumber of I/O203Voltage2.25 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2880Number of Logic Elements/Cells2880
Number of Gates48000ECCN3A991DHTS Code8542.39.0001
QualificationN/A

Overview of A54SX32A-FGG256I – SX-A Field Programmable Gate Array (FPGA) IC 203 256-BGA

The A54SX32A-FGG256I is a nonvolatile SX-A family FPGA offered in a 256-ball fine-pitch BGA package. It provides 48,000 system gates and 2,880 logic elements with up to 203 user I/O pins, and supports mixed-voltage operation across a wide supply range.

Designed for industrial-temperature applications, this single-chip FPGA combines configurable I/O flexibility, in-system diagnostics and secure programming features to address mixed-voltage, PCI-capable designs requiring deterministic timing and nonvolatile configuration.

Key Features

  • Logic Capacity — 48,000 system gates and 2,880 logic elements providing mid-range logic density for control, interface and glue-logic implementations.
  • I/O Count & Flexibility — 203 user I/O pins with configurable support for 3.3 V/5 V PCI, 5 V TTL, 3.3 V LVTTL and 2.5 V LVCMOS2 signaling; configurable weak pull-up or pull-down at power-up.
  • Mixed-Voltage Operation — Operates across a wide supply range from 2.25 V to 5.25 V with 5 V input tolerance and 5 V drive strength where applicable.
  • Performance — SX-A family performance characteristics include up to 250 MHz system performance and up to 350 MHz internal performance for time-critical logic paths.
  • Nonvolatile, Single-Chip Solution — Built-in nonvolatile configuration removes the need for external configuration memory and enables instant-on behavior after power-up.
  • Power-Up/Down Friendly — No supply sequencing required for power-up or power-down, simplifying multi-rail system designs.
  • System Reliability & Test — Boundary-scan (IEEE 1149.1 JTAG) support and unique in-system diagnostic and verification capability for board-level testing and debug.
  • Security — Secure programming technology with FuseLock™ prevents reverse engineering and protects design IP.
  • Package & Temperature — 256-ball FBGA (256-FPBGA, 17×17) package in an industrial temperature grade with an operating range of −40 °C to 85 °C.

Typical Applications

  • PCI and bus interface peripherals — 66 MHz PCI compliance and configurable 3.3 V/5 V PCI I/O support make this device suited for PCI-based interface logic and peripheral controllers.
  • Mixed-voltage system glue logic — Wide supply voltage range and multi-standard I/O support simplify integration between 5 V legacy logic and modern lower-voltage rails.
  • Industrial control and automation — Industrial temperature grade and deterministic timing support control systems, I/O aggregation and sensor/interface processing in industrial environments.
  • In-system test and verification — Boundary-scan and on-chip diagnostic capabilities streamline board bring-up, testing and field diagnostics.

Unique Advantages

  • Single-chip nonvolatile configuration: Eliminates external configuration memory and simplifies system boot behavior.
  • Flexible mixed-voltage I/O: Broad I/O standard support and 5 V tolerance reduce the need for level-shifting components.
  • Industrial temperature rating: Rated for −40 °C to 85 °C operation to meet extended-environment requirements.
  • Secure programming and diagnostics: FuseLock™ security and in-system diagnostic features protect IP and aid in validation and field troubleshooting.
  • Robust packaging: 256-ball FBGA (17×17) delivers a compact footprint with high I/O count for space-constrained boards.
  • Deterministic timing and performance: Family-level device performance supports time-sensitive logic with predictable behavior for embedded designs.

Why Choose A54SX32A-FGG256I?

The A54SX32A-FGG256I positions itself as a mid-density, nonvolatile FPGA option for industrial designs that require mixed-voltage I/O, secure configuration and in-system diagnostics. Its combination of 48,000 system gates, 2,880 logic elements and up to 203 user I/Os in a compact 256-ball FBGA package provides a practical balance of integration and board-area efficiency.

This device is suitable for engineers building PCI-capable interfaces, mixed-voltage glue logic, and industrial control systems that value deterministic timing, secure programming and simplified power sequencing. The industrial temperature rating and broad supply range support deployment in extended-environment applications while reducing external BOM complexity.

Request a quote or submit an inquiry for the A54SX32A-FGG256I to receive pricing and availability details tailored to your project requirements.

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