A54SX32A-FGG484

IC FPGA 249 I/O 484FBGA
Part Description

SX-A Field Programmable Gate Array (FPGA) IC 249 484-BGA

Quantity 753 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time52 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (27X27)GradeCommercialOperating Temperature0°C – 70°C
Package / Case484-BGANumber of I/O249Voltage2.25 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2880Number of Logic Elements/Cells2880
Number of Gates48000ECCN3A991DHTS Code8542.39.0001
QualificationN/A

Overview of A54SX32A-FGG484 – SX-A Field Programmable Gate Array (FPGA) IC 249 484-BGA

The A54SX32A-FGG484 is a member of the SX-A family of nonvolatile FPGAs. It provides a mid-range logic capacity and dense I/O in a 484-ball fine-pitch BGA package, suited for commercial embedded and board-level applications requiring reprogrammable logic and configurable I/O.

Designed for single-chip, nonvolatile operation, this device combines 48,000 system gates with 2,880 logic elements and up to 249 user I/Os, delivering deterministic timing and family-level performance characteristics for system and interface control tasks.

Key Features

  • Logic Capacity  48,000 system gates and 2,880 logic elements provide mid-range programmable logic resources for combinational and sequential logic implementation.
  • High-density I/O  Up to 249 user I/Os allow extensive peripheral and bus interfacing directly from the FPGA package.
  • Performance  Family datasheet specifies system performance up to 250 MHz and internal performance up to 350 MHz for timing-critical paths.
  • Configurable I/O Standards  Supports configurable I/O for multiple voltage standards including 3.3 V/5 V PCI, 5 V TTL, 3.3 V LVTTL, and 2.5 V LVCMOS2 with 5 V input tolerance and 5 V drive strength.
  • Nonvolatile Single-Chip Solution  On-chip nonvolatile configuration enables single-chip operation without external configuration memory.
  • Power and I/O Robustness  Hot-swap compliant I/Os and power-up/down friendly operation (no sequencing required for supply voltages) simplify system power management.
  • Package and Mounting  484-ball fine-pitch BGA (484-FPBGA, 27×27 mm) surface-mount package for compact board layouts and dense routing.
  • Voltage and Temperature  Supports a supply range of 2.25 V to 5.25 V and is specified for commercial temperature operation from 0 °C to 70 °C.
  • Test, Security and Diagnostics  Boundary-scan testing (IEEE 1149.1/JTAG), in-system diagnostic capability, and Actel Secure Programming Technology (FuseLock™) for design protection.

Typical Applications

  • PCI and Bus Interface Logic  Use the configurable 3.3 V/5 V PCI support and 66 MHz PCI compliance for implementing PCI interface glue logic and protocol bridging.
  • Embedded Control  Implement system control, protocol translation, and board-level arbitration tasks using the device’s logic capacity and abundant I/Os.
  • Peripheral and I/O Expansion  Provide dense, reprogrammable I/O handling for sensor aggregation, display/control front-ends, or custom peripheral interfaces.
  • In-System Diagnostics and Test  Leverage built-in boundary-scan and in-system diagnostic features for manufacturing test and field verification workflows.

Unique Advantages

  • Balanced Logic and I/O Density: 48,000 system gates with 2,880 logic elements and 249 I/Os deliver a practical balance of resources for mid-range designs.
  • Flexible Voltage Support: Wide supply range (2.25–5.25 V) and multi-standard I/O support simplify integration with mixed-voltage boards and legacy interfaces.
  • Nonvolatile Configuration: Single-chip nonvolatile operation removes the need for external configuration components for on-power-up configuration.
  • Robust I/O Behavior: Hot-swap compliance and power-up/down friendly I/Os reduce board-level power sequencing complexity.
  • Security and Testability: FuseLock™ programming and IEEE 1149.1 boundary-scan provide mechanisms for design protection and standard test access.
  • Compact, Surface-Mount Package: 484-FPBGA (27×27 mm) packaging enables high-density PCB layouts while supporting extensive I/O.

Why Choose A54SX32A-FGG484?

The A54SX32A-FGG484 positions itself as a versatile mid-range FPGA option within the SX-A family, combining a solid logic footprint (48,000 system gates and 2,880 logic elements) with high I/O count and family-level performance characteristics. Its nonvolatile single-chip architecture, configurable multi-standard I/Os, and robust I/O behaviors make it suitable for commercial embedded designs that require reprogrammable logic, on-chip configuration retention, and extensive interfacing capability.

This device is appropriate for engineering teams designing commercial embedded systems, PCI interface logic, and board-level control/bridge functions where deterministic timing, in-system diagnostics, and design protection are required. RoHS-compliant packaging supports regulatory compliance for commercial deployments.

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