A54SX72A-1FGG256

The A54SX72A-1FGG256 is a commercial-grade, nonvolatile SX-A family FPGA supplied in a 256-ball fine-pitch BGA package. It delivers a high-density, single-chip programmable logic solution with 108,000 system gates and 6,036 logic elements for complex glue logic, protocol bridging, and system-control functions in commercial electronic designs.

Designed for mixed-voltage I/O and flexible timing control, this device targets commercial embedded systems that require a compact, reprogrammable logic resource with on-chip security and in-system diagnostics.

Key Features

• Core performance — Family-level performance targets include up to 250 MHz system performance and up to 350 MHz internal performance; device capacity is 108,000 system gates and 6,036 logic elements.
• Flip-flops and clocking — Up to 2,012 dedicated flip-flops with 3 global clocks and 4 quadrant clocks for organized clock distribution and synchronous designs.
• I/O flexibility — 203 user-programmable I/Os; configurable I/O support for 5 V PCI, 5 V TTL, 3.3 V LVTTL and 2.5 V LVCMOS2; hot-swap compliant I/Os and 5 V input tolerance are supported at the series level.
• Memory and resources — Total on-chip RAM bits: 0 (device relies on flip-flops and logic elements for state and buffering).
• Power and voltage — Supply voltage range 2.25 V to 5.25 V; power-up/power-down friendly operation (no sequencing required) is supported at the family level.
• Package & mounting — 256-ball fine-pitch FBGA (256-FPBGA, 17×17) in a surface-mount package optimized for compact board designs.
• Commercial temperature grade — Rated for 0 °C to 70 °C operation (commercial grade).
• Security and testability — Nonvolatile, single-chip configuration; boundary-scan (IEEE 1149.1) and family-level secure programming technology with FuseLock™ for protection against reverse engineering; in-system diagnostic and verification capability available.

Typical Applications

• PCI-based embedded controllers — Implement glue logic and interface control in commercial PCI systems using the device's PCI-capable I/O support and mixed-voltage tolerance.
• Interface bridging and protocol glue — Use the abundant I/O (203 pins) and dense logic resource (6,036 logic elements) to consolidate multiple interface functions onto a single chip.
• Secure system control — Leverage the nonvolatile single-chip configuration and on-device secure programming features for protected control logic and system initialization tasks.

Unique Advantages

• High logic density in a compact package: 108,000 system gates and 6,036 logic elements in a 256-FPBGA (17×17) allow complex designs in space-constrained boards.
• Flexible mixed-voltage I/O: Configurable I/O standards and broad supply voltage range enable straightforward interfacing with 2.5 V, 3.3 V and 5 V domains.
• Deterministic timing and clocking: Multiple global and quadrant clock resources combined with family-level deterministic timing controls simplify timing closure for synchronous designs.
• Nonvolatile, single-chip solution: Eliminates external configuration memory and reduces BOM for simpler board-level integration.
• Built-in test and security: Boundary-scan support and family-level secure programming (FuseLock™) aid manufacturing test and IP protection strategies.
• Commercial-ready thermal profile: Rated for 0 °C to 70 °C to match typical commercial electronics deployment environments.

Why Choose A54SX72A-1FGG256?

The A54SX72A-1FGG256 combines a high gate count and a large number of logic elements with flexible, mixed-voltage I/O and a compact 256-ball fine-pitch BGA package. Its nonvolatile single-chip architecture simplifies system design by removing the need for external configuration memory while providing in-system diagnostic and security features.

This device is well suited to commercial embedded designs that require consolidated interface logic, reliable nonvolatile configuration, and flexible I/O standards. It delivers a balance of density, I/O capability, and compact packaging that helps reduce board-level complexity and BOM.

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