A54SX72A-1FGG256I

IC FPGA 203 I/O 256FBGA
Part Description

SX-A Field Programmable Gate Array (FPGA) IC 203 256-BGA

Quantity 955 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case256-BGANumber of I/O203Voltage2.25 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs6036Number of Logic Elements/Cells6036
Number of Gates108000ECCN3A991DHTS Code8542.39.0001
QualificationN/A

Overview of A54SX72A-1FGG256I – SX-A Field Programmable Gate Array (FPGA) IC 203 256-BGA

The A54SX72A-1FGG256I is a nonvolatile SX-A family FPGA in a 256-pin fine-pitch BGA package, offering a high-density, reprogrammable logic solution for industrial embedded systems. Built on the SX-A architecture, this device provides a combination of logic capacity, flexible mixed-voltage I/O and system-level features that address interface bridging, control and in-system programmable logic needs.

Key value comes from its 108,000 system gates equivalent and 6,036 logic elements, support for mixed 2.5/3.3/5 V operation, and industrial-grade temperature range—enabling robust designs that require dense logic, configurable I/O and secure nonvolatile configuration.

Key Features

  • High Logic Capacity — 108,000 system gates equivalent and 6,036 logic elements provide substantial programmable logic resources for complex glue logic, state machines and custom datapaths.
  • User I/O and Mixed-Voltage Support — 203 user I/Os on this package with configurable I/O support across 5 V TTL, 3.3 V LVTTL and 2.5 V LVCMOS2, enabling mixed-voltage system interfacing.
  • Nonvolatile Single-Chip Solution — SX-A family nonvolatile architecture retains configuration without external configuration memory, simplifying board design and system initialization.
  • Package and Mounting — 256-pin fine-pitch BGA (256-FPBGA, 17×17) in a surface-mount form factor for compact board layouts and reliable soldered connections.
  • Wide Supply Range — Operates from 2.25 V to 5.25 V, providing design flexibility across different power domains and legacy signaling requirements.
  • Industrial Temperature Grade — Specified for operation from −40 °C to 85 °C, suitable for industrial environments.
  • System-Level Features (SX-A family) — Hot-swap compliant I/Os, power-up/power-down friendly behavior (no supply sequencing required), IEEE 1149.1 JTAG boundary-scan, and support for 66 MHz PCI signaling as part of the SX-A feature set.
  • Security and Test — Actel Secure Programming Technology with FuseLock™ in the SX-A family prevents reverse engineering and supports in-system diagnostics and verification.
  • Standards and Compliance — RoHS-compliant device packaging.

Typical Applications

  • Industrial Control — Implements custom control logic, sequencing and interface glue in automation and factory equipment while meeting industrial temperature requirements.
  • Mixed-Voltage Interface Bridging — Bridges legacy 5 V subsystems with modern 2.5/3.3 V logic using configurable I/O and wide supply range.
  • Embedded System Glue Logic — Provides dense programmable logic for bus arbitration, protocol adapters and custom peripherals in compact board layouts.
  • PCI-Capable Systems — Useful in systems requiring PCI-level interfacing thanks to SX-A family 66 MHz PCI compliance.
  • Secure In-System Programmability — Protects design IP and supports secure field updates via the family’s Secure Programming features.

Unique Advantages

  • High integration density: 108,000 system gates and 6,036 logic elements reduce external glue logic and lower BOM complexity.
  • Flexible power and I/O: 2.25–5.25 V supply range and configurable I/O enable straightforward integration into mixed-voltage systems.
  • Nonvolatile configuration: Single-chip, nonvolatile architecture removes the need for external configuration memory and simplifies system boot behavior.
  • Industrial readiness: Specified operation from −40 °C to 85 °C supports deployment in industrial environments.
  • Security and testability: Built-in FuseLock security and IEEE 1149.1 boundary-scan support protect IP and simplify production testing.
  • Compact, board-friendly package: 256-FPBGA (17×17) surface-mount package enables dense, reliable PCB layouts.

Why Choose A54SX72A-1FGG256I?

The A54SX72A-1FGG256I delivers a balance of high logic capacity, mixed-voltage I/O flexibility and industrial temperature operation in a nonvolatile SX-A family FPGA. It is well suited for designers who need substantial on-chip logic resources and secure in-system programmability without adding external configuration components.

This device is a practical choice for industrial embedded designs, interface bridging, PCI-capable subsystems and applications that require secure, compact and robust programmable logic. Its combination of package density, I/O configurability and family-level system features supports scalable, long-term deployments.

Request a quote or submit an inquiry to learn about availability, pricing and lead times for the A54SX72A-1FGG256I. Our team can provide purchasing details and assist with technical questions.

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