A54SX72A-1PQG208

The A54SX72A-1PQG208 is a nonvolatile SX-A family FPGA from Microchip Technology, offered in a 208-pin BFQFP surface-mount package. It delivers 108,000 system gates implemented as approximately 6,036 logic elements with up to 171 user I/Os, targeting mixed‑voltage interfacing and mid-density programmable logic functions.

Designed for applications that require deterministic timing, mixed-voltage I/O support and in-system verification, this device provides a single-chip, nonvolatile solution with a supply range of 2.25 V to 5.25 V and a commercial operating temperature range of 0 °C to 70 °C.

Key Features

• Core capacity — 108,000 system gates and approximately 6,036 logic elements provide a mid-density FPGA resource set for glue logic, protocol bridging and control functions.
• Flip-flop and timing resources — Family documentation lists up to 2,012 dedicated flip-flops and deterministic, user-controllable timing for reliable, predictable performance.
• I/O and mixed-voltage support — 171 user-programmable I/Os with configurable I/O support for 3.3 V / 5 V PCI, 5 V TTL, 3.3 V LVTTL and 2.5 V LVCMOS2. Supports 2.5 V, 3.3 V and 5 V mixed-voltage operation with 5 V input tolerance and 5 V drive strength.
• Performance — Device family specifications list up to 250 MHz system performance and up to 350 MHz internal performance for timing-critical paths.
• Nonvolatile, single-chip solution — On-chip nonvolatile configuration removes the need for external configuration memory and simplifies power-up behavior.
• Robust I/O behavior — Hot-swap compliant I/Os, power-up/power-down friendly operation (no sequencing required for supply voltages), configurable weak pull-up/pull-down on I/O at power-up and individual output slew rate control.
• Debug and security — In-system diagnostic and verification capability with Silicon Explorer II, boundary-scan testing (IEEE 1149.1 JTAG) and Actel secure programming technology with FuseLock™ for design protection.
• Package, supply and environment — 208-pin BFQFP (supplier package listed as 208-PQFP 28×28), surface-mount, supply range 2.25 V to 5.25 V, operating temperature 0 °C to 70 °C, RoHS compliant.

Typical Applications

• Mixed‑voltage interface bridging — Use the configurable I/O and 5 V tolerance to bridge between legacy 5 V buses and modern 2.5/3.3 V logic domains.
• PCI and legacy bus logic — Family support for 66 MHz PCI and PCI I/O levels enables implementation of bus glue logic and protocol support functions.
• In-system diagnostic and verification — Silicon Explorer II and JTAG boundary-scan support simplify board-level validation and in-field diagnostics.
• Control and sequencing logic — Deterministic timing and dedicated flip-flops make the device suitable for deterministic control state machines and sequencing tasks.

Unique Advantages

• Nonvolatile configuration: Eliminates external configuration memory, simplifying BOM and board design for single‑chip FPGA deployment.
• Flexible mixed-voltage I/O: 2.5 V–5 V mixed-voltage operation with 5 V input tolerance reduces the need for level‑shifters when interfacing multiple voltage domains.
• Predictable timing: Deterministic, user-controllable timing combined with documented internal performance supports reliable timing closure for critical paths.
• Built-in test and security: Silicon Explorer II diagnostics, IEEE 1149.1 boundary-scan and FuseLock secure programming provide in-system testability and IP protection.
• Compact package with ample I/O: 208-pin surface-mount package with 171 user I/Os balances board-space efficiency with I/O availability.
• Wide supply range: 2.25 V to 5.25 V supply support allows flexible power architectures and mixed-voltage designs.

Why Choose A54SX72A-1PQG208?

The A54SX72A-1PQG208 positions itself as a midsize, nonvolatile FPGA option for designs that demand mixed-voltage interfacing, deterministic timing and in-system debug capability. With approximately 6,036 logic elements, 108,000 system gates and 171 user I/Os in a 208-pin surface-mount package, it is well suited for control logic, bus interfacing and system glue applications where a single-chip, nonvolatile solution simplifies design.

Engineers benefit from features such as hot‑swap compliant I/Os, configurable power-up behavior, boundary-scan and secure programming for board-level reliability and IP protection. The device is offered in a commercial temperature grade and RoHS-compliant packaging for standard industrial and commercial deployments.

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