A54SX72A-CQ256
| Part Description |
SX-A Field Programmable Gate Array (FPGA) IC 203 256-BFCQFP with Tie Bar |
|---|---|
| Quantity | 1,437 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 36 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-CQFP (75x75) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BFCQFP with Tie Bar | Number of I/O | 203 | Voltage | 2.25 V - 5.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 6036 | Number of Logic Elements/Cells | 6036 | ||
| Number of Gates | 108000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of A54SX72A-CQ256 – SX-A Field Programmable Gate Array (FPGA) IC 203 256-BFCQFP with Tie Bar
The A54SX72A-CQ256 is a commercial-grade FPGA from Microchip Technology’s SX‑A family, delivered in a 256‑lead ceramic CQFP package with tie bar. It provides a high‑density programmable logic option, combining approximately 108,000 system gates and 6,036 logic elements with a high pin count for complex glue‑logic, control and interface tasks.
Designed for applications that require flexible I/O and wide supply tolerance, this surface‑mount FPGA supports mixed 2.25 V to 5.25 V supplies and up to 203 user I/O pins in the 256‑pin package while meeting RoHS requirements.
Key Features
- Core Logic Approximately 6,036 logic elements providing a total of 108,000 system gates for implementing medium to high complexity logic functions.
- I/O Capacity 203 user‑programmable I/O pins on the 256‑lead package to support wide peripheral and interface connectivity.
- Supply Voltage Flexibility Operates across a broad supply range from 2.25 V to 5.25 V, enabling use with multiple voltage domains and interface standards.
- Package & Mounting 256‑BFCQFP (with tie bar) / supplier device package 256‑CQFP (75 × 75) in a surface‑mount format suitable for automated assembly and handling.
- Commercial Temperature Grade Rated for operation from 0 °C to 70 °C for commercial applications.
- Memory No embedded on‑chip RAM (Total Ram Bits: 0), useful for deterministic logic implementations that do not rely on internal block RAM.
- RoHS Compliance Conforms to RoHS requirements for environmentally conscious designs.
Typical Applications
- Consumer and Industrial Electronics Implement interface logic, protocol bridging and custom control functions in commercial devices where a high I/O count and flexible supply options are required.
- Communications Equipment Use as glue logic or packet handling accelerators requiring dense combinatorial logic and many I/O connections.
- Test and Measurement Deploy for custom signal routing, timing control and instrumentation front‑end logic in lab and bench equipment.
- Embedded Control Perform system control, sequencers and peripheral management in embedded platforms that benefit from configurable logic resources.
Unique Advantages
- High Logic Integration: 6,036 logic elements and 108,000 system gates consolidate complex designs into a single device, reducing board-level component count.
- Large I/O Count: 203 user I/Os in the 256‑lead package enable extensive peripheral and bus connectivity without external multiplexing.
- Wide Supply Range: 2.25 V to 5.25 V operation allows flexible interfacing with multiple voltage domains and legacy interfaces.
- Surface-Mount Ceramic Package with Tie Bar: The 256‑BFCQFP with tie bar aids automated handling and PCB assembly while providing a dense pinout in a compact footprint.
- Commercial Temperature Suitability: Rated 0 °C to 70 °C for applications targeting commercial environments.
- RoHS Compliant: Supports environmentally driven procurement and regulatory needs.
Why Choose A54SX72A-CQ256?
The A54SX72A-CQ256 offers a balanced combination of high logic density, substantial I/O capacity and flexible supply operation for commercial embedded designs that require configurable logic and extensive peripheral interfacing. Packaged in a 256‑lead CQFP with tie bar, it is suited to board-level designs where automated assembly and a compact, high‑pin solution are priorities.
Backed by Microchip Technology’s SX‑A family documentation and available in a RoHS‑compliant ceramic CQFP package, the A54SX72A-CQ256 is positioned for engineers and procurement teams seeking a programmable logic device capable of replacing discrete glue logic and simplifying system design while maintaining clear, verifiable specifications.
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