A54SX72A-FFG484

The A54SX72A-FFG484 is a nonvolatile, single-chip SX-A family FPGA designed for applications that require high I/O density and substantial logic capacity. The device integrates up to 108,000 system gates, 6,036 logic elements, and up to 2,012 dedicated flip-flops, making it suitable for board-level programmable logic and I/O-rich designs.

Built for mixed-voltage systems, the device provides flexible I/O configuration and system-level features such as hot-swap compliant I/Os, boundary-scan (IEEE 1149.1), and in-system diagnostic support, enabling reliable integration into commercial electronic systems.

Key Features

• Core Performance Up to 108,000 system gates with published family performance points (250 MHz system performance, 350 MHz internal performance in the SX-A family).
• Logic Resources 6,036 logic elements and up to 2,012 dedicated flip-flops for complex combinatorial and sequential logic implementations.
• I/O and Interface Flexibility Up to 360 user-programmable I/Os with configurable I/O support for 3.3 V / 5 V PCI, 5 V TTL, 3.3 V LVTTL, and 2.5 V LVCMOS2; supports mixed-voltage operation with 5 V input tolerance and 5 V drive strength.
• Nonvolatile Single-Chip Solution On-chip nonvolatile configuration eliminates the need for external configuration memory and simplifies system power-up behavior.
• Power and System Robustness Power supply range from 2.25 V to 5.25 V and power-up/power-down friendly operation that requires no supply sequencing; hot-swap compliant I/Os for board-level flexibility.
• Security and Test Actel Secure Programming Technology with FuseLock™ to protect designs from reverse engineering, plus boundary-scan testing compliant with IEEE 1149.1 (JTAG).
• Package and Mounting 484-ball fine-pitch BGA (484-FPBGA, 27×27), surface-mount package suitable for high-density board designs.
• Commercial Temperature Grade Operating temperature range 0 °C to 70 °C for commercial applications.
• Memory No embedded RAM (total RAM bits: 0) as specified for this device.

Typical Applications

• PCI and High-Speed I/O Interfaces Use the device’s 66 MHz PCI compliance and extensive I/O configurability for board-level PCI bus implementations and mixed-voltage interface bridging.
• High-Density Board Logic Deploy the 6,036 logic elements and up to 108,000 system gates for glue logic, protocol adapters, and custom hardware acceleration on compact PCBs.
• Secure, Field-Programmable Systems Leverage FuseLock™ secure programming for designs that require protection of intellectual property while supporting field updates.
• Designs Requiring Boundary-Scan Integrate boundary-scan (IEEE 1149.1) capability to simplify board-level test and diagnostics during manufacturing and service.

Unique Advantages

• Highly Integrated, Nonvolatile FPGA: Single-chip nonvolatile architecture removes the need for external configuration storage, simplifying BOM and system initialization.
• Extensive I/O Count: Up to 360 user-programmable I/Os enable dense peripheral and interface routing without external switchers.
• Flexible Mixed-Voltage Support: Native support for 2.5 V, 3.3 V, and 5 V mixed-voltage operation with 5 V input tolerance allows direct interfacing to a broad range of legacy and modern logic levels.
• System-Friendly Power Behavior: Power-up/power-down friendly operation with no required supply sequencing and hot-swap compliant I/Os reduce system-level integration risk.
• Design Security and Testability: FuseLock™ technology and IEEE 1149.1 boundary-scan improve IP protection and manufacturing test coverage.
• Commercial Temperature Suitability: Rated for 0 °C to 70 °C, matching typical commercial electronics use cases.

Why Choose A54SX72A-FFG484?

The A54SX72A-FFG484 positions itself as a high-I/O, nonvolatile FPGA for commercial applications that require substantial logic capacity and secure, board-level programmability. With 6,036 logic elements, up to 108,000 system gates, and up to 360 user I/Os, it supports complex glue logic, interface adaptation, and secure firmware-controlled functionality in a single surface-mount package.

Its mixed-voltage I/O flexibility, hot-swap compliance, and built-in security and test features provide a practical platform for reducing system BOM, simplifying integration, and accelerating time to production in commercial electronic designs.

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