AFS1500-1FG676

The AFS1500-1FG676 is a Fusion® Field Programmable Gate Array (FPGA) offering 38,400 logic elements, approximately 0.276 Mbits of embedded memory, and up to 252 I/O pins in a compact 676-FBGA (27×27) package. It implements roughly 1,500,000 gates of programmable logic in a surface-mount form factor optimized for commercial-grade designs.

This device targets designs that need medium-density programmable logic, moderate on-chip RAM, and a high I/O count while operating from a 1.425–1.575 V supply and within a commercial temperature range of 0 °C to 85 °C. It is RoHS-compliant for environmental conformance.

Key Features

• Core Logic 38,400 logic elements providing flexible programmable logic resources and a total of approximately 1,500,000 gates for implementing custom digital functionality.
• Embedded Memory Approximately 0.276 Mbits of on-chip RAM to support buffering, state storage, and local data processing without external memory.
• I/O Capacity 252 general-purpose I/O pins to accommodate parallel interfaces, control signals, and mixed-signal integration at the board level.
• Power and Voltage Single-supply operation across 1.425 V to 1.575 V to match system power domains requiring tight supply specifications.
• Package and Mounting 676-FBGA (27×27) package case with surface-mount mounting type for dense board layouts and automated assembly.
• Operating Range and Grade Commercial grade operation from 0 °C to 85 °C, suitable for general-purpose embedded and consumer applications.
• Regulatory Status RoHS-compliant to support regulatory and environmental requirements.

Typical Applications

• Custom digital processing — Implement application-specific logic and datapath functions using the device's 38,400 logic elements and 1.5M gates.
• I/O-intensive control — Handle multiple parallel interfaces and signal routing with 252 available I/O pins for control panels, instrument panels, and interface bridges.
• Embedded buffering and state machines — Use the on-chip RAM for local buffering, FIFOs, and finite-state-machine implementations without external memory.
• Compact board designs — Leverage the 676-FBGA (27×27) package and surface-mount mounting to minimize PCB footprint while retaining substantial logic capacity.

Unique Advantages

• Substantial programmable logic density: 38,400 logic elements and approximately 1.5M gates enable complex custom logic implementations without discretely adding many ICs.
• Integrated on-chip memory: Approximately 0.276 Mbits of embedded RAM reduces dependency on external SRAM/DRAM for mid-sized buffering and state retention.
• High I/O count: 252 I/O pins provide flexibility for interfacing multiple peripherals, sensors, or external controllers directly to the FPGA fabric.
• Compact package: 676-FBGA (27×27) allows dense PCB placement and supports automated surface-mount assembly processes.
• Commercial temperature range: Rated 0 °C to 85 °C for applications operating within standard commercial environments.
• RoHS-compliant: Facilitates environmental compliance requirements and simplifies supply-chain considerations.

Why Choose AFS1500-1FG676?

The AFS1500-1FG676 positions itself as a medium-density Fusion® FPGA that balances logic capacity, embedded memory, and a high I/O count in a compact 676-FBGA package. Its combination of 38,400 logic elements, approximately 0.276 Mbits of on-chip RAM, and 252 I/Os makes it suitable for engineers designing space-conscious systems that require substantial programmable logic and local memory.

This device is well suited for teams building commercial-grade embedded systems that need scalable programmable logic, solid integration, and RoHS compliance. Its electrical and packaging specifications support reliable deployment in a range of general-purpose applications where a balance of logic, I/O, and package density is required.

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