AFS1500-1FGG256K

The AFS1500-1FGG256K is a Fusion® field programmable gate array from Microchip Technology designed for applications requiring moderate logic density and flexible I/O. It integrates 38,400 logic elements and approximately 0.276 Mbits of embedded memory to implement custom digital functions, control logic, and interface glue in space-constrained board designs.

With 119 user I/O, a 256-pin LBGA footprint, and a military-grade operating range, this device targets designs that require reliable operation across wide temperatures and a compact package for surface-mount assembly.

Key Features

• Logic Capacity  38,400 logic elements (cells), enabling implementation of complex custom logic and control functions within a single device.
• Embedded Memory  Approximately 0.276 Mbits of on-chip RAM for buffering, small lookup tables, and state storage without external memory.
• I/O Resources  119 user I/O pins to support multiple interfaces, parallel buses, and mixed-signal connectivity on modern PCBs.
• Gate Count  1,500,000 gates providing the fundamental building blocks for combinational and sequential logic designs.
• Power  Core voltage supply range of 1.425 V to 1.575 V to match system power rails and ensure predictable power design.
• Package & Mounting  256-LBGA (supplier package 256-FPBGA, 17×17 mm) in a surface-mount form factor for compact board layouts.
• Temperature & Grade  Military-grade device with an operating temperature range of −55 °C to 100 °C for demanding environmental use.
• RoHS Compliance  RoHS compliant, supporting regulatory requirements for lead-free assembly.

Typical Applications

• Military & Defense Systems  Military-grade temperature range and reliability make the device suitable for rugged embedded control, signal routing, and custom processing tasks in defense electronics.
• Embedded Control  Compact LBGA package and substantial logic capacity allow integration of control engines, state machines, and interface bridging in constrained PCB real estate.
• High-Density I/O Interfaces  119 I/O pins enable the FPGA to act as a central I/O concentrator for sensor arrays, communication ports, and peripheral expansion.

Unique Advantages

• Substantial Logic Resources: 38,400 logic elements and 1,500,000 gates provide the capacity to consolidate multiple discrete functions into one programmable device, reducing BOM and board complexity.
• On‑Chip Memory: Approximately 0.276 Mbits of embedded RAM supports buffering and local data storage, minimizing or eliminating the need for small external memories.
• Wide Operating Temperature: Rated from −55 °C to 100 °C to support designs that must tolerate extreme thermal conditions without performance compromise.
• Compact Surface-Mount Package: 256-LBGA (256-FPBGA, 17×17) delivers a small footprint for space-constrained systems while maintaining ample I/O connectivity.
• Predictable Power Envelope: Narrow core supply range (1.425 V–1.575 V) simplifies power rail design and voltage margining for reliable operation.
• Regulatory Compliance: RoHS compliant to meet lead-free assembly requirements for commercial and regulated deployments.

Why Choose AFS1500-1FGG256K?

The AFS1500-1FGG256K combines a substantial logic element count, embedded memory, and a broad I/O complement in a compact 256-LBGA package, positioning it for projects that need on-board programmability, moderate density, and dependable operation across extreme temperatures. Its military grade and RoHS compliance make it suitable for long-life and environmentally demanding applications.

Designed and manufactured by Microchip Technology, this Fusion® FPGA delivers a balance of integration, ruggedness, and package efficiency for engineers developing control systems, interface concentrators, and fielded embedded electronics that require configurable logic with defined electrical and environmental specifications.

Request a quote or contact sales to discuss availability, pricing, and to obtain supporting documentation for the AFS1500-1FGG256K.