AFS1500-1FGG676

The AFS1500-1FGG676 is a Fusion® family field programmable gate array from Microchip Technology, delivered in a 676-ball FBGA (27×27) surface-mount package. It provides a balance of logic density, embedded memory, and I/O connectivity for commercial-grade programmable logic designs.

With 38,400 logic elements, approximately 0.28 Mbits of embedded memory, 252 user I/Os and a core supply range of 1.425 V to 1.575 V, this device targets applications that require mid-range programmable logic, flexible interfacing and compact board-level integration.

Key Features

• Logic Capacity — 38,400 logic elements (logic cells) and approximately 1,500,000 gates to implement custom digital functions and state machines.
• Embedded Memory — Total on-chip RAM of 276,480 bits (approximately 0.28 Mbits) for buffering, FIFOs and lookup tables.
• I/O Count — 252 user I/Os to support multiple parallel interfaces and signal domains on a single device.
• Package and Mounting — 676-ball FBGA (27×27) package in a surface-mount form factor for high-density PCB designs.
• Power — Core supply voltage range from 1.425 V to 1.575 V to match target power architectures.
• Operating Conditions — Commercial-grade operation from 0 °C to 85 °C for standard environmental deployments.
• RoHS Compliant — Meets RoHS environmental requirements for lead-free assembly.

Typical Applications

• Embedded Control and Prototyping — Use the 38,400 logic elements and on-chip RAM for custom control logic, algorithm prototyping or glue-logic consolidation in commercial products.
• Multi-I/O Interface Hubs — 252 I/Os enable aggregation of multiple parallel interfaces and protocol bridges on a single FPGA package.
• Signal Processing and Data Handling — On-chip RAM and gate capacity support intermediate buffering and custom data-path implementations.

Unique Advantages

• Balanced Logic and Memory: 38,400 logic elements paired with approximately 0.28 Mbits of embedded RAM provide a practical mix of resources for mid-range designs.
• High I/O Density: 252 user I/Os reduce the need for external I/O expanders and simplify board-level routing for multi-interface systems.
• Compact, High-Density Package: The 676-FBGA (27×27) package enables high pin-count integration in a compact footprint for space-constrained PCBs.
• Commercial-Grade Readiness: Specified for 0 °C to 85 °C operation and RoHS compliance to align with standard commercial product requirements.
• Predictable Power Envelope: Defined core supply range (1.425 V–1.575 V) allows straightforward power-system design and sequencing.

Why Choose AFS1500-1FGG676?

The AFS1500-1FGG676 combines mid-range logic capacity, embedded memory and a high I/O count in a compact 676-FBGA package, making it well suited for commercial designs that need flexible, board-level programmable logic. Its specification set supports consolidation of glue logic, interface bridging and data buffering while fitting standard surface-mount assembly processes.

Backed by Microchip Technology, this Fusion® FPGA offers a clear resource profile for designers seeking scalable logic and I/O capacity with commercial-grade operating range and RoHS compliance for mainstream product development.

Request a quote or contact sales to discuss pricing, availability and lead times for the AFS1500-1FGG676.