AFS1500-2FG256

The AFS1500-2FG256 is a Fusion® Field Programmable Gate Array (FPGA) from Microchip Technology designed for commercial-temperature programmable-logic applications. It offers a balance of logic density, embedded memory, and I/O capability in a compact 256-LBGA package for surface-mount assembly.

With 1,500,000 gates, 38,400 logic elements and approximately 0.276 Mbits of on-chip RAM, this device targets designs that require medium-to-high integration of custom digital logic and embedded memory while operating from a 1.425 V to 1.575 V core supply.

Key Features

• Logic Capacity 38,400 logic elements (LEs) and 1,500,000 gates provide programmable logic resources for custom digital functions and complex state machines.
• Embedded Memory Approximately 0.276 Mbits of total on-chip RAM bits suitable for localized buffering, small FIFOs and scratchpad storage.
• I/O Count 119 user I/O pins to support multiple peripheral interfaces and parallel connections within a single device.
• Package and Mounting 256-LBGA (supplier package: 256-FPBGA, 17×17 mm) optimized for surface-mount PCB assembly and dense board layouts.
• Power Core supply voltage range of 1.425 V to 1.575 V to match target power-rail designs.
• Operating Range and Grade Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Regulatory RoHS compliant.

Typical Applications

• Custom Digital Logic Implement application-specific state machines and glue logic using the device's 38,400 logic elements and 1,500,000 gates.
• Memory-Backed Functions Use the on-chip RAM (approximately 0.276 Mbits) for buffering, small lookup tables, and temporary data storage close to logic blocks.
• I/O-Intensive Interfaces Deploy the 119 I/Os for parallel buses, peripheral interfaces, and signal aggregation without external GPIO expanders.

Unique Advantages

• Highly integrated programmable logic: 1,500,000 gates and 38,400 logic elements reduce the need for multiple discrete ICs by consolidating logic into a single device.
• On-chip embedded memory: Approximately 0.276 Mbits of RAM enables local buffering and data manipulation without immediate dependence on external memory.
• Ample I/O density: 119 user I/Os simplify board-level design by accommodating multiple interfaces and parallel connections directly on-chip.
• Compact LBGA footprint: 256-LBGA (17×17 mm) supports high-density PCB layouts while remaining suitable for surface-mount manufacturing.
• Commercial-grade operating range: Rated 0 °C to 85 °C for applications and environments that meet commercial temperature requirements.
• RoHS compliant: Conforms to RoHS requirements for lead-free manufacturing and environmental compliance.

Why Choose AFS1500-2FG256?

The AFS1500-2FG256 provides a practical combination of programmable logic density, embedded memory, and I/O resources in a compact 256-LBGA package from Microchip Technology. Its specification set—38,400 logic elements, 1,500,000 gates, approximately 0.276 Mbits of on-chip RAM, and 119 I/Os—suits designers seeking to integrate custom digital functions and moderate embedded memory without expanding board count.

Ideal for commercial-temperature designs where integration, I/O capacity and compact packaging matter, this Fusion® FPGA offers a verifiable, component-level option for mid-complexity programmable logic implementations. RoHS compliance and surface-mount packaging support modern assembly and environmental requirements.

Request a quote or submit an inquiry to receive pricing, availability and technical support for AFS1500-2FG256.