AFS1500-2FG676

The AFS1500-2FG676 is a Fusion® Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for commercial-grade embedded applications. It provides a high-density programmable fabric with 1,500,000 gates, 38,400 logic elements, and approximately 0.276 Mbits of embedded memory to address complex logic and memory needs.

With 252 user I/Os, a 676-FBGA (27×27) package, a narrow supply range of 1.425 V to 1.575 V, and an operating temperature range of 0 °C to 85 °C, the device is intended for surface-mount integration where compact packaging, substantial I/O count, and on-chip memory are required.

Key Features

• Core Logic 1,500,000 gates and 38,400 logic elements provide high-density programmable logic resources for complex design implementations.
• Embedded Memory Approximately 0.276 Mbits of on-chip RAM supports local buffering, state storage, and small data tables without external memory.
• I/O Capacity 252 user I/Os enable wide connectivity options for peripheral interfaces, sensor arrays, or multi-channel signal routing.
• Package and Mounting 676-FBGA (27×27) package in a 676-BGA case with surface-mount mounting for dense PCB layouts and compact system footprints.
• Power Specified supply range of 1.425 V to 1.575 V for core operation, enabling controlled power provisioning in the target system.
• Operating Conditions Commercial-grade operating temperature range of 0 °C to 85 °C and RoHS compliance for standard commercial production environments.

Typical Applications

• Commercial Embedded Systems — Use the FPGA to implement custom logic and integration in mid-range embedded products where commercial grading is appropriate.
• High-Density Logic Integration — Deploy the device where substantial gate count and logic elements are needed to consolidate multiple functions into a single programmable device.
• I/O-Intensive Interfaces — Leverage 252 I/Os for designs requiring many external connections, such as sensor aggregation, multi-channel control, or flexible peripheral interfacing.

Unique Advantages

• High Logic Density: 1,500,000 gates and 38,400 logic elements allow complex designs to be implemented on a single FPGA, reducing system-level component count.
• On-Chip Memory for Local Storage: Approximately 0.276 Mbits of embedded RAM supports buffering and state retention without immediate dependence on external memory.
• Extensive Connectivity: 252 I/Os provide flexibility to connect multiple peripherals, sensors, or interfaces directly to the FPGA fabric.
• Compact, Surface-Mount Package: The 676-FBGA (27×27) package enables dense PCB placement while maintaining a large I/O footprint.
• Commercial-Grade Specification: Rated for 0 °C to 85 °C operation and RoHS compliant, suitable for standard commercial production environments.

Why Choose AFS1500-2FG676?

The AFS1500-2FG676 positions itself as a high-density Fusion FPGA option for designers who need a balance of significant logic resources, embedded memory, and a large I/O count in a compact BGA package. Its commercial-grade temperature range and RoHS compliance make it appropriate for mainstream embedded product designs.

This device is well suited to customers seeking to consolidate multiple logic functions onto a single programmable device, optimize board space with a 676-FBGA package, and leverage on-chip memory and abundant I/Os to simplify system architecture and reduce bill-of-materials complexity.

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