AFS1500-2FGG256
| Part Description |
Fusion® Field Programmable Gate Array (FPGA) IC 119 276480 256-LBGA |
|---|---|
| Quantity | 232 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 119 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 38400 | Number of Logic Elements/Cells | 38400 | ||
| Number of Gates | 1500000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 276480 |
Overview of AFS1500-2FGG256 – Fusion® FPGA, 38,400 logic elements, 119 I/O, 256-LBGA
The AFS1500-2FGG256 is a Fusion® Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for compact, I/O-focused programmable logic applications. It provides a balance of logic capacity, on-chip memory and I/O density in a 256-LBGA package for surface-mount assembly.
With 38,400 logic elements, approximately 0.276 Mbits of embedded memory and 119 I/O, this commercial-grade device is suited to embedded systems, communications equipment, consumer electronics and prototyping where integration and predictable supply requirements matter.
Key Features
- Core Logic 38,400 logic elements (logic cells) and approximately 1,500,000 gates provide configurable logic capacity for a wide range of digital designs.
- Embedded Memory Approximately 0.276 Mbits (276,480 bits) of on-chip RAM for buffering, state storage and small data structures.
- I/O Density 119 user I/O pins to support multi-peripheral interfacing and intermediate bus connections.
- Power and Supply Operates from a device supply range of 1.425 V to 1.575 V to match system power domains.
- Package & Mounting 256-LBGA (supplier device package: 256-FPBGA, 17×17) in a surface-mount form factor for compact board layouts.
- Operating Range & Grade Commercial grade operation from 0 °C to 85 °C for general-purpose embedded applications.
- Compliance RoHS-compliant construction for regulatory and product stewardship considerations.
Typical Applications
- Consumer Electronics Use the FPGA for custom control logic, user interface handling and peripheral aggregation where compact package and moderate logic density are needed.
- Communications Equipment Implement protocol bridging, packet handling or control plane logic using the device’s I/O count and embedded memory for buffering.
- Embedded Control Systems Deploy the FPGA for sensor interfacing, I/O consolidation and real-time control tasks in commercial-grade embedded products.
- Prototyping & Evaluation Suitable for early-stage hardware development and proof-of-concept designs that require reprogrammable logic and a compact package.
Unique Advantages
- Balanced Logic Capacity: 38,400 logic elements deliver substantial configurability without excessive board space or power complexity.
- On-chip Memory for Local Storage: Approximately 0.276 Mbits of embedded RAM supports buffering and small data structures directly on-chip.
- High I/O Count: 119 I/O pins enable flexible connectivity to peripherals, sensors and external interfaces.
- Compact, Surface-Mount Package: 256-LBGA (17×17 FPBGA) simplifies integration into space-constrained PCBs and modern assembly processes.
- Predictable Supply and Compliance: Narrow supply voltage window and RoHS compliance make power planning and regulatory alignment straightforward.
Why Choose AFS1500-2FGG256?
The AFS1500-2FGG256 positions itself as a practical, commercially graded FPGA for designers seeking a mid-range logic device with a strong balance of logic elements, embedded memory and I/O in a compact LBGA package. Its documented supply voltage range and operating temperature make it suitable for commercial embedded products and development platforms.
Engineers and procurement teams benefit from an FPGA that delivers reprogrammable logic capacity, on-chip memory and substantial I/O within a surface-mount 256-LBGA footprint, backed by Microchip Technology manufacturing and RoHS compliance for long-term product planning.
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