AFS1500-2FGG484

IC FPGA 223 I/O 484FBGA
Part Description

Fusion® Field Programmable Gate Array (FPGA) IC 223 276480 484-BGA

Quantity 287 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BGANumber of I/O223Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs38400Number of Logic Elements/Cells38400
Number of Gates1500000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits276480

Overview of AFS1500-2FGG484 – Fusion FPGA, 484-BGA, 223 I/Os

The AFS1500-2FGG484 is a Fusion® field programmable gate array (FPGA) designed for commercial-grade embedded logic applications. It integrates 38,400 logic elements with on-chip memory and a 223-pin I/O complement in a 484-ball BGA package, delivering a compact programmable fabric for system designers.

Typical use cases include designs that require a mid-range logic count, substantial I/O connectivity, and a compact surface-mount 484-FPBGA (23×23) footprint. The device is RoHS compliant and operates over a commercial temperature range with a specified core supply window.

Key Features

  • Core Logic  38,400 logic elements (logic cells) providing programmable resources for custom digital logic implementation.
  • Embedded Memory  Approximately 0.276 Mbits of on-chip RAM (276,480 total RAM bits) to support buffering, state machines, and small data stores.
  • I/O Density  223 general-purpose I/O pins to support broad interfacing needs with peripherals and external devices.
  • Gate Capacity  1,500,000 gates offering a measure of overall logic capacity for mixed-function designs.
  • Power  Operates from a core supply range of 1.425 V to 1.575 V, enabling defined power budgeting for system design.
  • Package & Mounting  484-BGA package (supplier device package: 484-FPBGA, 23×23) with surface-mount mounting for compact PCB integration.
  • Operating Range & Grade  Commercial temperature grade, specified for 0 °C to 85 °C operation and RoHS compliance for environmental adherence.

Unique Advantages

  • High logic density: 38,400 logic elements provide a solid balance of programmable resources for mid-range FPGA designs, reducing the need for external glue logic.
  • Ample embedded memory: Approximately 0.276 Mbits of on-chip RAM supports local buffering and state storage without immediate external memory.
  • Broad I/O capability: 223 I/O pins enable complex peripheral interfacing and high pin-count signal routing in a single device.
  • Compact BGA footprint: 484-FPBGA (23×23) packaging allows dense PCB layouts while retaining significant internal resources.
  • Defined power window: Narrow supply range (1.425 V–1.575 V) simplifies core power sequencing and supply selection.
  • RoHS compliant: Environmentally compliant manufacturing for simplified regulatory considerations.

Why Choose AFS1500-2FGG484?

The AFS1500-2FGG484 is positioned for designers who need a commercially graded, mid-capacity FPGA with considerable I/O and local memory in a compact surface-mount BGA package. Its combination of 38,400 logic elements, approximately 0.276 Mbits of embedded RAM, and 223 I/Os provides a balanced feature set for embedded applications requiring moderate programmable logic and connectivity.

Choose this Fusion® FPGA when you require a single-device solution that simplifies board-level integration while offering predictable power and temperature characteristics. The part’s RoHS compliance and clearly specified electrical and thermal limits support reliable procurement and deployment in commercial products.

Request a quote or submit an inquiry through your preferred procurement channel to begin sourcing AFS1500-2FGG484 for your next design.

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