AFS1500-2FGG676I

The AFS1500-2FGG676I is a Fusion® Field Programmable Gate Array from Microchip Technology offering a programmable fabric with 1,500,000 gates and 38,400 logic elements. Packaged in a 676-BGA (supplier device package: 676-FBGA (27x27)) surface-mount package, it provides a high I/O count and embedded memory for integration into industrial designs.

With 252 I/Os, approximately 0.276 Mbits of embedded memory, an industrial-grade operating range of −40 °C to 100 °C, and a supply voltage window of 1.425 V to 1.575 V, this device is suited to applications that require significant on-chip logic, extensive I/O, and industrial temperature performance.

Key Features

• Core Logic 1,500,000 gates and 38,400 logic elements deliver programmable capacity for complex logic implementations.
• Embedded Memory Approximately 0.276 Mbits of on-chip RAM to support state storage, buffering, and intermediate data processing.
• I/O Density 252 general-purpose I/Os to consolidate peripheral interfaces and system-level signals.
• Package & Mounting 676-BGA package (supplier device package: 676-FBGA (27x27)), surface-mount for board-level integration in compact layouts.
• Power Operates from a supply voltage range of 1.425 V to 1.575 V to match targeted system power rails.
• Temperature Range Industrial operating range from −40 °C to 100 °C for deployment in temperature-demanding environments.
• Regulatory Compliance RoHS compliant to support environmentally regulated manufacturing processes.

Typical Applications

• Industrial Control Systems — Designed for industrial-grade environments requiring wide temperature operation and robust logic capacity.
• High I/O Interface Aggregation — Consolidate multiple peripherals and sensors using up to 252 I/Os in a single programmable device.
• Custom Logic Integration — Implement application-specific functions and algorithm acceleration with 38,400 logic elements and 1.5M gates of capacity.

Unique Advantages

• Significant Logic Capacity: 1,500,000 gates paired with 38,400 logic elements provide ample resources for complex custom designs.
• On-Chip Memory: Approximately 0.276 Mbits of embedded RAM reduces external memory requirements for control and buffering tasks.
• High I/O Count: 252 I/Os allow extensive peripheral and signal interfacing without adding external glue logic.
• Industrial Temperature Range: −40 °C to 100 °C rating supports deployments in harsh and temperature-variable environments.
• Compact BGA Package: 676-BGA (676-FBGA (27x27)) surface-mount packaging enables dense PCB layouts while maintaining signal density.
• Standards-Friendly: RoHS compliance aligns with environmental manufacturing requirements.

Why Choose AFS1500-2FGG676I?

The AFS1500-2FGG676I combines substantial programmable logic, embedded memory, and a high I/O count in an industrial-grade BGA package from Microchip Technology. Its specification set—1.5M gates, 38,400 logic elements, ~0.276 Mbits of RAM, 252 I/Os, and −40 °C to 100 °C operation—positions it for designs that demand integrated logic capacity and reliable operation across temperature extremes.

This device is a practical choice for engineers and procurement teams building industrial systems that require scalable logic, dense I/O integration, and compliance with RoHS. The AFS1500-2FGG676I supports implementations where board-level density, controlled supply range, and industrial thermal tolerance are key selection criteria.

Request a quote or submit an inquiry for pricing and availability of the AFS1500-2FGG676I to begin integrating this Fusion® FPGA into your next industrial design.