AFS1500-FG256I

The AFS1500-FG256I is a Fusion® Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for industrial-grade programmable logic implementations. It delivers 1,500,000 gates and 38,400 logic elements in a compact 256-LBGA package, combining logic density, embedded memory and a 119-pin I/O count for flexible system integration.

With a supply voltage range of 1.425 V to 1.575 V, RoHS compliance, and an operating temperature range of -40 °C to 100 °C, this device targets industrial applications that require robust thermal and environmental performance in a surface-mount form factor.

Key Features

• Core Logic 38,400 logic elements providing a total of 1,500,000 gates for mid-density programmable logic implementations.
• Embedded Memory Approximately 0.276 Mbits of on-chip RAM (276,480 total RAM bits) to support buffering, state storage and local data processing.
• I/O Capacity 119 general-purpose I/O pins to interface with sensors, peripherals and external logic.
• Power Single supply operation with a specified voltage range of 1.425 V to 1.575 V for stable core supply requirements.
• Package and Mounting 256-LBGA package (supplier device package: 256-FPBGA, 17 × 17 mm) optimized for surface-mount PCB assembly.
• Industrial Temperature Range Specified operating temperature from -40 °C to 100 °C for deployment in demanding environments.
• Regulatory RoHS compliant for environmental and manufacturing requirements.

Typical Applications

• Industrial Control Systems — Implement custom logic and control functions using 38,400 logic elements and 119 I/O for sensor and actuator interfacing in industrial equipment.
• Embedded Processing — Use on-chip RAM and programmable logic to implement protocol handling, data buffering and application-specific processing tasks.
• Interface and Glue Logic — Provide deterministic, reconfigurable interface logic between mixed subsystems where a compact BGA package and surface-mount mounting are required.

Unique Advantages

• Balanced Logic Density: 1,500,000 gates and 38,400 logic elements deliver substantial programmable capacity for mid-range designs without excessive board-level complexity.
• Integrated Memory: Approximately 0.276 Mbits of embedded RAM reduces the need for external buffering and simplifies system memory architectures.
• Robust I/O Count: 119 I/O pins enable flexible connectivity to peripherals, sensors and external interfaces.
• Industrial-Grade Operation: Rated from -40 °C to 100 °C to meet the thermal demands of industrial deployments.
• Compact, Surface-Mount Package: 256-LBGA (256-FPBGA, 17 × 17 mm) allows high-density board layouts while supporting standard surface-mount assembly processes.
• Regulatory Compliance: RoHS compliance supports environmentally conscious manufacturing and product design.

Why Choose AFS1500-FG256I?

The AFS1500-FG256I positions itself as an industrial-grade Fusion® FPGA offering a practical balance of logic capacity, embedded memory and I/O flexibility in a compact 256-LBGA package. Its defined supply voltage range, extended temperature rating and RoHS compliance make it suitable for engineered systems that require reliable programmable logic in challenging environments.

This device is well suited for engineers and procurement teams designing industrial control, embedded processing or interface logic solutions who need a mid-density FPGA platform supported by Microchip Technology.

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