AFS1500-2FGG676

The AFS1500-2FGG676 is a Fusion® field programmable gate array (FPGA) IC from Microchip Technology designed for commercial applications that require programmable logic and flexible I/O. It combines a high logic element count with embedded memory and a large I/O complement in a compact FBGA package.

This device is suited for commercial embedded designs and prototype systems where a balance of logic capacity, I/O density and on-chip RAM is needed. Key electrical and environmental attributes include a core supply window of 1.425 V to 1.575 V and an operating temperature range of 0 °C to 85 °C.

Key Features

• Core and Logic  Offers 38,400 logic elements and approximately 1,500,000 gates to implement complex programmable logic and custom functions.
• Embedded Memory  Provides approximately 0.276 Mbits (276,480 bits) of on-chip RAM for buffering, lookup tables and small data storage directly within the FPGA fabric.
• I/O Capability  Includes 252 general-purpose I/O pins to support a wide range of external interfaces and connectivity options.
• Power  Requires a core supply in the range of 1.425 V to 1.575 V, enabling consistent power planning for system-level design.
• Package and Mounting  Supplied in a 676-ball FBGA package (676-BGA, 27×27) for compact, surface-mount board integration.
• Operating Range and Grade  Rated for commercial operation with an ambient temperature range of 0 °C to 85 °C and a commercial grade designation.
• Regulatory Compliance  RoHS compliant for lead-free assembly and global environmental requirements.

Typical Applications

• Commercial Embedded Systems  Used to implement control logic, data handling and custom processing in commercial electronic equipment within the specified temperature range.
• Communications and Interface Bridging  Suitable for designs that require flexible I/O routing and mid-range logic capacity to bridge signals between subsystems.
• Prototyping and Development  Well suited for evaluation and development of programmable logic functions where a high count of logic elements and ample I/O are needed for proof-of-concept designs.

Unique Advantages

• High logic capacity: 38,400 logic elements and approximately 1.5M gates provide room for sizable logic implementations without external devices.
• On-chip memory: Approximately 0.276 Mbits of embedded RAM reduces dependence on external memory for small buffering and lookup functions.
• Generous I/O count: 252 I/O pins enable integration of multiple interfaces and peripherals on a single FPGA device.
• Compact FBGA package: 676-ball (27×27) FBGA supports high-density board layouts while maintaining surface-mount assembly.
• Commercial-grade specification: 0 °C to 85 °C operating range and RoHS compliance align with commercial product development and manufacturing.

Why Choose AFS1500-2FGG676?

The AFS1500-2FGG676 Fusion® FPGA targets designers who need a mid-to-high-density programmable logic device with substantial I/O and on-chip RAM in a compact BGA package. Its combination of 38,400 logic elements, 252 I/Os and embedded memory offers a balanced platform for commercial embedded systems, communications interfaces and development projects.

Choosing this part supports scalable designs that benefit from integrated logic and memory, a defined commercial temperature range, and RoHS compliance for assembly. It is a practical option for teams seeking a Microchip Fusion® FPGA solution with clear, verifiable specifications for system implementation.

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