AFS1500-2FGG256I

The AFS1500-2FGG256I is a Fusion® Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for embedded logic implementations requiring significant gate count and on-chip memory. It combines 38,400 logic elements with approximately 0.28 Mbits of embedded RAM and 1,500,000 gates to support complex programmable logic designs.

Engineered for surface-mount applications, this industrial-grade device operates from a 1.425 V to 1.575 V supply and across an operating temperature range of −40 °C to 100 °C, making it suitable for temperature-demanding environments where robust, reprogrammable logic is required.

Key Features

• Core Density  38,400 logic elements and 1,500,000 gates provide significant capacity for implementing medium-to-large scale logic functions.
• Embedded Memory  Approximately 0.28 Mbits of on-chip RAM (276,480 total RAM bits) for data buffering, state storage, and custom memory structures.
• I/O Resources  119 available I/O pins to connect peripherals, sensors, and external interfaces within a compact footprint.
• Package & Mounting  256-LBGA package (supplier device package: 256-FPBGA, 17×17) with surface-mount construction for board-level integration.
• Power  Narrow operating core supply range of 1.425 V to 1.575 V for predictable power design and supply planning.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C, suited to designs requiring extended temperature operation.
• Compliance  RoHS compliant to support environmental and regulatory requirements.

Unique Advantages

• Substantial logic capacity: 38,400 logic elements and 1.5M gates enable integration of complex state machines, datapaths, and control logic into a single device, reducing component count.
• On-chip memory for local storage: 276,480 bits of embedded RAM provide flexible, fast-access storage for buffering and temporary data without external memory.
• Compact, board-ready package: 256-LBGA (256-FPBGA, 17×17) surface-mount package simplifies PCB layout and supports higher density designs.
• Industrial temperature range: −40 °C to 100 °C rating supports deployment in thermally challenging environments.
• Predictable power requirements: Defined supply range (1.425 V–1.575 V) aids power-supply design and margin verification.
• Environmentally compliant: RoHS compliance aligns with regulatory and corporate environmental goals.

Why Choose AFS1500-2FGG256I?

The AFS1500-2FGG256I positions itself as a reliable, industrial-grade FPGA option for designs that require a balance of high logic density, embedded RAM, and a robust thermal envelope. Its combination of 38,400 logic elements, ~0.28 Mbits of embedded memory, and 119 I/O make it well suited for integrators seeking to consolidate programmable logic into a single, surface-mount package from a recognized manufacturer.

With clearly defined supply requirements and RoHS compliance, this Fusion® FPGA IC offers a practical choice for projects where predictable power design, board-level integration, and extended temperature operation are priorities.

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