AFS1500-2FG676I

The AFS1500-2FG676I is a Fusion® Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides a reprogrammable logic fabric with 38,400 logic elements and approximately 276,480 bits of embedded RAM to implement custom digital functions and interfaces.

Designed as a surface-mount device in a 676-FBGA (27 × 27) package, the device supports 252 I/O pins and operates from a 1.425 V to 1.575 V supply. The part is specified for industrial use with an operating temperature range of −40 °C to 100 °C.

Key Features

• Core Logic: 38,400 logic elements to implement custom combinational and sequential logic.
• On-Chip Memory: Approximately 276,480 bits of embedded RAM for buffering, state storage, and on-chip data processing.
• I/O Capacity: 252 user I/O pins to support multiple external interfaces and parallel connections.
• Integration Density: Approximately 1,500,000 gates providing substantial logic capacity within a single device.
• Power Supply: Operates from a 1.425 V to 1.575 V core supply for predictable power provisioning.
• Package & Mounting: 676-FBGA (27 × 27) package in a surface-mount form factor for compact PCB integration.
• Temperature & Grade: Industrial grade with an operating temperature range of −40 °C to 100 °C for harsher environments.
• RoHS Compliance: RoHS compliant for environmental and regulatory alignment.

Typical Applications

• Industrial Control Systems — Use the device where industrial temperature range and extensive I/O count are required for machine control and automation interfaces.
• Interface Bridging and Custom I/O — 252 I/Os enable flexible protocol bridging and custom peripheral interfacing on a single FPGA.
• Embedded System Prototyping — Ample logic elements and on-chip RAM support development of custom logic, state machines, and data-path prototypes.
• Communication and Data Processing — On-chip memory and dense logic resources provide local buffering and processing for custom packet handling or signal conditioning tasks.

Unique Advantages

• Substantial Logic Capacity: 38,400 logic elements and about 1.5 million gates let designers implement complex, multi-function logic on a single device.
• Significant Embedded Memory: Approximately 276,480 bits of on-chip RAM reduce dependence on external memory for many buffering and state requirements.
• High I/O Count: 252 I/Os enable broad connectivity options, minimizing the need for additional interface chips.
• Industrial Temperature Range: Specified operation from −40 °C to 100 °C supports deployment in temperature-challenging environments.
• Compact SMT Package: 676-FBGA (27 × 27) surface-mount package allows for high-density PCB layouts while providing the pin count necessary for complex systems.
• Regulatory Alignment: RoHS compliance supports environmental and manufacturing requirements.

Why Choose AFS1500-2FG676I?

The AFS1500-2FG676I combines a large logic fabric, substantial embedded memory, and a high I/O count in a single industrial-grade FPGA package from Microchip Technology. This configuration is suited to systems that require on-board programmability, flexible interfacing, and operation across a wide temperature range.

Engineers specifying this device benefit from reduced external component count through integrated RAM and abundant I/O, a compact 676-FBGA footprint for dense PCB designs, and industrial-grade temperature support for robust deployments. It is appropriate for designs needing scalable logic capacity and reliable operation in demanding environments.

Request a quote or contact sales to submit a quote for the AFS1500-2FG676I and discuss availability and lead times.