AFS1500-2FG256I

The AFS1500-2FG256I is a Fusion® Field Programmable Gate Array (FPGA) IC from Microchip Technology, provided in a 256-LBGA package. It combines a high logic capacity with embedded memory and a substantial I/O count to address industrial embedded designs.

Built for surface-mount applications, this industrial-grade FPGA offers 38,400 logic elements and approximately 0.276 Mbits of on-chip RAM, with a supply voltage range of 1.425 V to 1.575 V and an operating temperature range of −40 °C to 100 °C.

Key Features

• Core Logic 1,500,000 gates and 38,400 logic elements provide the programmable fabric for implementing custom digital functions and moderate-complexity designs.
• Embedded Memory Approximately 0.276 Mbits of on-chip RAM (276,480 bits) for data buffering, FIFOs, and small working memory needs within the FPGA fabric.
• I/O Resources 119 general-purpose I/O pins to support multiple interfaces and peripheral connections directly from the device.
• Package and Mounting Delivered in a 256-LBGA package (supplier device package: 256-FPBGA, 17 × 17 mm) designed for surface-mount assembly and compact board layouts.
• Power Operates from a defined core supply range of 1.425 V to 1.575 V to match system power-rail planning and regulator selection.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C, suitable for industrial-environment deployments.
• RoHS Compliant Meets RoHS requirements for reduced hazardous substances in electronic assemblies.

Unique Advantages

• High logic density: 1.5 million gates and 38,400 logic elements enable substantial on-chip integration, reducing the need for multiple devices.
• On-chip memory for local buffering: Approximately 0.276 Mbits of embedded RAM supports data staging and small on-chip storage without external memory.
• Ample I/O capacity: 119 I/Os allow flexible interfacing to peripherals, sensors, and external logic directly from the FPGA.
• Industrial-qualified thermal range: −40 °C to 100 °C operation aligns with industrial deployment requirements for reliability in varied environments.
• Compact, PCB-friendly package: 256-LBGA / 256-FPBGA (17 × 17 mm) minimizes board footprint while providing robust ball-grid connections for high-density layouts.
• Defined core supply window: A narrow 1.425 V to 1.575 V supply range simplifies power budgeting and regulator selection for the FPGA core.

Why Choose AFS1500-2FG256I?

The AFS1500-2FG256I positions itself as a capable industrial-grade FPGA choice for designers who need a balance of logic capacity, on-chip memory, and a substantial I/O count in a compact BGA package. Its specified operating temperature range and RoHS compliance make it suitable for industrial embedded applications where environmental resilience and regulatory compliance matter.

Engineers and procurement teams looking for a Microchip-supplied FPGA with clear power and temperature specifications will find the AFS1500-2FG256I applicable to designs that require moderate to high logic integration and flexible interfacing while maintaining a small board footprint.

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